Zobrazeno 1 - 10
of 570
pro vyhledávání: '"Masumi Saka"'
Publikováno v:
AIMS Materials Science, Vol 5, Iss 4, Pp 591-602 (2018)
With recent advances in technology, micro/nanomaterials have attracted a great deal of attention because of their superior properties compared with the bulk materials. Stress-induced migration (SM) has been used to fabricate micro/nanomaterials becau
Externí odkaz:
https://doaj.org/article/1e3425dd00754087ad43788ea8ef3aa6
Publikováno v:
MRS Communications. 9:1331-1334
To examine the influence of ultrasonic irradiation on electrochemical migration (ECM), the morphology of micro/nanodeposits and current change were studied. The morphology of deposits synthesized by ECM varied with the types of ultrasonic irradiation
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::79060a58b0561efefd2841b875843130
https://doi.org/10.1557/mrc.2019.135
https://doi.org/10.1557/mrc.2019.135
Publikováno v:
MRS Communications. 9:773-777
This study investigated the effect of plastic deformation on anodic dissolution in electrochemical migration (ECM) through the growth of deposits. The morphology of deposits synthesized by ECM was analyzed using scanning electron microscopy, where sp
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5cbd2247ab266b1cd0a174cd853f44fc
https://doi.org/10.1557/mrc.2019.68
https://doi.org/10.1557/mrc.2019.68
Publikováno v:
Materials Letters. 236:420-423
The morphological control of hybrid Cu–Cu2O nanostructures during electrochemical migration (ECM) fabrication was systematically investigated by performing a series of current-stressing experiments. Here, in order to induce ECM, a direct voltage wa
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3e6f5d5d2297fbdfa5db47cd864a99c4
https://doi.org/10.1016/j.matlet.2018.10.146
https://doi.org/10.1016/j.matlet.2018.10.146
Autor:
Teruki Nakakura, Masumi Saka
Publikováno v:
Micro & Nano Letters. 13:923-926
Fabrication of Ag micro/nanostructures was studied because of their excellent chemical, electrical, and optical properties. Ag micro/nanostructures are usually produced via chemical methods, but these methods require the processing of waste liquid an
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d0aef76e94b60b6605395d16dca26517
https://doi.org/10.1049/mnl.2017.0913
https://doi.org/10.1049/mnl.2017.0913
Publikováno v:
Microsystem Technologies. 24:3907-3913
In this work, an evaluation method was presented to systematically characterize the electrical and thermal properties of a metallic thin-film line. A series of current-stressing experiments were carried out on the Ag thin-film lines with different ge
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::987d6232442184bb4090e9359355f926
https://doi.org/10.1007/s00542-018-3878-2
https://doi.org/10.1007/s00542-018-3878-2
Publikováno v:
Mechanical Engineering Letters. 4:17-00604
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2312defee547259337e7db0691e282e8
https://doi.org/10.1299/mel.17-00604
https://doi.org/10.1299/mel.17-00604
Publikováno v:
Materials Research Bulletin. 87:155-160
With a high Li storage capacity, Sn-based materials have attracted great attention as a prospective anode material for lithium ion batteries (LIBs). However, the poor cycling performance due to repetitive volume expansion/contraction during charge/di
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::63d0a07692142cd07482fb5a2faf5b08
https://doi.org/10.1016/j.materresbull.2016.11.041
https://doi.org/10.1016/j.materresbull.2016.11.041
Publikováno v:
Materials Letters. 184:219-222
Electromigration (EM) is a serious problem for an Al line subjected to high-density electron flow. The present work reports a strategy for achieving a suitable passivation thickness on the line against EM damage. Experiments carried out in this work
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2890293d5aa80f72d5f65a0232f87d39
https://doi.org/10.1016/j.matlet.2016.08.059
https://doi.org/10.1016/j.matlet.2016.08.059
Autor:
Yasuhiro Kimura, Masumi Saka
Publikováno v:
Journal of Electronic Packaging. 141
A critical current density, a criterion of electromigration (EM) resistance in interconnects, above which EM damages initiate has been studied to minimize EM damages of interconnects. In general, the assessment of a critical current density is confin
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0da54cc7df98c479ebe8ec33aeb7de96
https://doi.org/10.1115/1.4042980
https://doi.org/10.1115/1.4042980