Zobrazeno 1 - 9
of 9
pro vyhledávání: '"Massimiliano Culpo"'
Modern scientific software stacks have become extremely complex, using many programming models and libraries to exploit a growing variety of GPUs and accelerators. Package managers can mitigate this complexity using dependency solvers, but they are r
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::141723ed9afcb9a8871779658ce863ce
http://arxiv.org/abs/2210.08404
http://arxiv.org/abs/2210.08404
Publikováno v:
CANOPIE-HPC@SC
Optimizing scientific code for specific microarchitectures is critical for performance, as each new processor generation supports new, specialized vector instructions. There is a lack of support for this in package managers and container ecosystems h
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cbd25949692a85cdf8d8e8ea01e544f9
https://doi.org/10.1109/canopiehpc51917.2020.00011
https://doi.org/10.1109/canopiehpc51917.2020.00011
Autor:
Massimiliano Culpo, Carlo de Falco
Publikováno v:
PAMM. 8:10065-10068
In this paper we present an approach to coupled electro–thermal circuit simulation. More precisely we derive from the heat diffusion PDE a thermal element model and we show how it can be included in a standard SPICE–like circuit simulator without
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::635bf680e144f318def72729efad0ad9
https://doi.org/10.1002/pamm.200810065
https://doi.org/10.1002/pamm.200810065
Autor:
Carlo de Falco, Massimiliano Culpo
Publikováno v:
PAMM. 8:10061-10064
In this paper we present the spatial discretization of the thermal element model for coupled electrothermal simulation introduced in [1] with a suitable multiscale Finite Element scheme. The structure of the local matrices for the the thermal element
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c93e002b03c3d7c14323083c0a403fa3
https://doi.org/10.1002/pamm.200810061
https://doi.org/10.1002/pamm.200810061
Publikováno v:
Mathematics in Industry ISBN: 9783662466711
We consider mathematical modeling in nanoelectronics, which causes coupled systems of differential algebraic equations and partial differential equations. Both modeling and discretization are investigated for the inclusion of advanced semiconductor b
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::40a5fa57502f69d0609cbf316a8791e8
https://doi.org/10.1007/978-3-662-46672-8_2
https://doi.org/10.1007/978-3-662-46672-8_2
Publikováno v:
Mathematics in Industry ISBN: 9783662466711
This chapter describes the Demonstrator Platform (DP), a framework for simulation of devices, interconnects, circuits, electromagnetic fields, and thermal effects. This framework is used to develop and test new mathematical methods and algorithms. Se
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e746acef448aaaa256cd6efb5221eb1e
https://doi.org/10.1007/978-3-662-46672-8_8
https://doi.org/10.1007/978-3-662-46672-8_8
Publikováno v:
Scientific Computing in Electrical Engineering SCEE 2008 ISBN: 9783642122934
In this work we address the well-posedness of the steady-state and transient problems stemming from the coupling of a network of lumped electric elements and a PDE model of heat diffusion in the chip substrate. In particular we consider the thermal e
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::560d31e9fbb55f3f772e2e99228a5f4f
http://hdl.handle.net/11311/561565
http://hdl.handle.net/11311/561565
Publikováno v:
Scientific Computing in Electrical Engineering SCEE 2008 ISBN: 9783642122934
We present a new strategy to perform chip-level electro-thermal simulation. In our approach electrical behaviour of each circuit element is modeled by standard compact models with an added temperature node (1; 2). Mutual heating is accounted for by a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::9bd8b0bc683a74bb074d5cf5c71d9fa1
http://hdl.handle.net/11311/561566
http://hdl.handle.net/11311/561566
Publikováno v:
Progress in Industrial Mathematics at ECMI 2008 ISBN: 9783642121098
We present a numerical method for solving Diffusion Reaction equations on two completely overlapping unstructured meshes which reduces the requirements on mesh generation software when strong local refinement is needed to capture features of the solu
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::a8e9a4d2bc3c2c91fea702dac16452b7
https://doi.org/10.1007/978-3-642-12110-4_33
https://doi.org/10.1007/978-3-642-12110-4_33