Zobrazeno 1 - 10
of 70
pro vyhledávání: '"Masazumi Amagai"'
Autor:
Iriguchi Shoichi, Yoshimi Takahashi, Philipp Steinmann, Yohei Koto, David C. Stepniak, Rajiv Dunne, Masazumi Amagai, Tom Bonifield
Publikováno v:
Transactions of The Japan Institute of Electronics Packaging. 5:122-131
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6c35b1c8da46e59d231586edac967e44
https://doi.org/10.5104/jiepeng.5.122
https://doi.org/10.5104/jiepeng.5.122
Publikováno v:
IEEE Transactions on Components and Packaging Technologies. 31:734-740
The purpose of this paper is to present our work on the effect of nickel (Ni) pad metallization thickness on fatigue failure of lead-free solder joints after thermal aging. Cyclic three-point bending tests were carried out to investigate the relation
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a8c96157b546908f3aad2262322390ad
https://doi.org/10.1109/tcapt.2008.2001841
https://doi.org/10.1109/tcapt.2008.2001841
Publikováno v:
Journal of Solid Mechanics and Materials Engineering. 1:1271-1280
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0d4721cf99aebfc56aca21838e1b09d7
https://doi.org/10.1299/jmmp.1.1271
https://doi.org/10.1299/jmmp.1.1271
Publikováno v:
Microelectronics Reliability. 46:459-466
In this paper, a new method is proposed for evaluating the high-cycle fatigue strength of BGA (Ball Grid Array) packages with Pb-free solder and Pb–Sn solder due to vibration. An attached weight induced mixed mode stress in the solder ball of a pac
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::57b0407a41eddffb8e13f67a8ea8422d
https://doi.org/10.1016/j.microrel.2005.02.003
https://doi.org/10.1016/j.microrel.2005.02.003
Publikováno v:
Scopus-Elsevier
The effects of 125°C holding time on static strength of package solder ball and impact strength of package solder ball have been investigated for BGA-IC package with Pb-free solder or Pb solder. A solder ball failure can be divided into ductile fail
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::18eceba2a83938a28b7efba1496ad0ed
https://doi.org/10.1299/kikaia.72.186
https://doi.org/10.1299/kikaia.72.186
Publikováno v:
Proceedings of 2005 International Symposium on Electrics Materials and Packaging. :232-237
This paper investigates the fatigue crack growth behaviors of lead-free solder joints. Metallurgical interactions occur between solders and electrical pad metals in fabrication process and these intermetallic compounds continue to grow during service
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::ccfec7ddbad94420bf86cce86bbfe6b1
http://t2r2.star.titech.ac.jp/cgi-bin/publicationinfo.cgi?q_publication_content_number=CTT100399552
http://t2r2.star.titech.ac.jp/cgi-bin/publicationinfo.cgi?q_publication_content_number=CTT100399552
Publikováno v:
TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A. 70:1725-1732
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c843ea4d0b63bdd6b40574e034477432
https://doi.org/10.1299/kikaia.70.1725
https://doi.org/10.1299/kikaia.70.1725
Autor:
Masazumi Amagai
Publikováno v:
Microelectronics Reliability. 42:607-627
The dramatic increase in the number of devices and functionality of the latest ultra large scale integration designs have resulted in increasing chip size. Concurrently, to achieve higher circuit board component densities, package dimensions have bee
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7f11e573ab34f9ea6f96074a9639663f
https://doi.org/10.1016/s0026-2714(02)00037-9
https://doi.org/10.1016/s0026-2714(02)00037-9
Publikováno v:
Microelectronics Reliability. 42:951-966
Recently, preventing environmental pollutions, lead-free (Pb-free) solders are about to replace tin–lead (Sn–Pb) eutectic solders. However, the mechanical properties of Pb-free solders have not been clarified. Hence, the following study was condu
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::06afe3b841945db39f5fca21f5d6cd70
http://t2r2.star.titech.ac.jp/cgi-bin/publicationinfo.cgi?q_publication_content_number=CTT100471173
http://t2r2.star.titech.ac.jp/cgi-bin/publicationinfo.cgi?q_publication_content_number=CTT100471173
Publikováno v:
Journal of Japan Institute of Electronics Packaging. 5:551-558
Recently, preventing environmental pollution, lead-free (Pb-free) solders are about to replace tin-lead (Sn-Pb) eutectic solders. However, the mechanical properties of Pb-free solders have not been clarified. Hence, the following study was conducted;
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0f0b5c0ec93880ba43a224c445b6ffb6
https://doi.org/10.5104/jiep.5.551
https://doi.org/10.5104/jiep.5.551