Zobrazeno 1 - 10
of 25
pro vyhledávání: '"Masayuki Ohe"'
Publikováno v:
Journal of Photopolymer Science and Technology. 31:451-456
Autor:
Masato Nishimura, Daisaku Matsukawa, Tetsuya Enomoto, Masayuki Ohe, Nakamura Tadamitsu, Noriyuki Yamazaki, Takeharu Motobe
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2017:1-15
Photo-definable polyimides (PI) and polybenzoxazoles (PBO) have been widely used as dielectrics for re-distribution layers in wafer level chip size packages (WL-CSP). These materials can simplify the manufacturing process and ensure high reliability
Publikováno v:
Journal of Photopolymer Science and Technology. 28:215-218
Autor:
Tetsuya Enomoto, Nakamura Tadamitsu, Nobuyuki Saito, Daisaku Matsukawa, Masayuki Ohe, Takeharu Motobe, Abe Satoshi, Noriyuki Yamazaki
Publikováno v:
2017 International Conference on Electronics Packaging (ICEP).
Hitachi Chemical DuPont MicroSystems (HDMS) has been developing photosensitive negative-tone polyimides (PI) and positive-tone poly(benzoxazole)s (PBO) for use as protection layers in semiconductor ICs or as dielectrics for re-distribution layers in
Autor:
Daisaku Matsukawa, Masayuki Ohe, Tetsuya Enomoto, Nakamura Tadamitsu, Masato Nishimura, Takeharu Motobe, Noriyuki Yamazaki
Publikováno v:
2016 IEEE CPMT Symposium Japan (ICSJ).
Photo-definable polyimides and polybenzoxazoles (PBO) have been widely used as dielectrics for re-distribution layers in wafer level chip size packages. These materials can simplify the manufacturing process and ensure high reliability owing to their
Autor:
Noritaka Matsuie, Noriyuki Yamazaki, Masato Nishimura, Tetsuya Enomoto, Masayuki Ohe, Daisaku Matsukawa
Publikováno v:
2016 IEEE CPMT Symposium Japan (ICSJ).
The reliability enhancement of polybenzoxazoles on Cu for Fan-out wafer level package was studied using TEG1 and 2 with simple re-distribution layer in Fan-out wafer level package. In TEG1 with patterned polybenzoxazole layer on Cu layer, the reliabi
Publikováno v:
2015 IEEE CPMT Symposium Japan (ICSJ).
Polyimides (PI) and polybenzoxazoles (PBO) have good heat resistance, mechanical properties and electrical insulation. Therefore, they have been widely used as buffer coating and interlayer dielectrics with protection property for electric applicatio
Autor:
Daisaku Matsukawa, Noritaka Matsuie, Tetsuya Enomoto, Kohei Mizuno, Atsutaro Yoshizawa, Masayuki Ohe
Publikováno v:
2015 IEEE CPMT Symposium Japan (ICSJ).
Positive-tone photo-definable poly(benzoxazole) (PBO) has been widely used as dielectric for re-distribution layer of wafer level chip size package. This material can simplify the manufacturing process and ensure the reliability owing to its good mec
Autor:
Masayuki Ohe, Konno Taku, Nakamura Yuki, Ono Keishi, Tomonori Minegishi, Takeharu Motobe, Masashi Kotani
Publikováno v:
Journal of Photopolymer Science and Technology. 23:477-482
Polyimide (PI) and poly(benzoxazole) (PBO) materials are widely used as stress buffer and rewiring cover layers to improve the reliability of semiconductors. With recent advances in this area, the chemical resistance of PI and PBO to organic solvents
Autor:
Toshiaki Tanaka, Takeharu Motobe, Yuichi Kaneya, Toshiaki Itabashi, Kohji Katoh, Masayuki Ohe, Soejima Kazuya
Publikováno v:
Journal of Photopolymer Science and Technology. 22:393-396
Polyimide (PI) materials have been widely used as stress buffer and rewiring cover layers to improve semiconductor reliability. As these applications require compatibility with various organic and/or inorganic materials, the effect of plasma treatmen