Zobrazeno 1 - 10
of 83
pro vyhledávání: '"Masayoshi Tateno"'
Autor:
Yosuke KOMATSU, Takashi YAMAMOTO, Daiji KATSURA, Keisuke YAMAKAWA, Hideyuki YUKAWA, Masayoshi TATENO
Publikováno v:
Nihon Kikai Gakkai ronbunshu, Vol 87, Iss 903, Pp 21-00140-21-00140 (2021)
Quantitative evaluation of uncertainty in acoustic properties is an essential issue to improve product quality. The acoustic properties of porous materials, such as sound absorption coefficient, are affected by variations in microstructure and materi
Externí odkaz:
https://doaj.org/article/9132e2f5443e468ebd06ccc9c7326852
Publikováno v:
Mechanical Engineering Journal, Vol 6, Iss 4, Pp 19-00062-19-00062 (2019)
This paper provides effects of furnace temperature conditions on the fracture toughness value of cleavage plane {110} on a single crystal silicon wafer. The fracture toughness KIC was measured using the controlled surface flaw (CSF) method under an a
Externí odkaz:
https://doaj.org/article/3a8dbfd35df649228ebfa1e73d67c99d
Publikováno v:
Mechanical Engineering Journal, Vol 6, Iss 3, Pp 18-00566-18-00566 (2019)
The focus of this study is to clarify the effects of an interface-edge shape on the bonding strength of a ceramics/metal joint. Each silicon nitride-to-nickel joint plate with an arc-shaped free-surface edge was prepared using wire-electric discharge
Externí odkaz:
https://doaj.org/article/76fdc5c3390244c19526c25b2a58622f
Publikováno v:
Mechanical Engineering Journal, Vol 6, Iss 3, Pp 18-00561-18-00561 (2019)
This study investigates the effects of interface edge configuration on the stress distribution near the edge of a ceramics/metal joint system interface using numerical thermal elastoplastic analysis. Finite element bonded dissimilar models were emplo
Externí odkaz:
https://doaj.org/article/0f008fa7bff94793a5471ebaa85568cb
Autor:
Daiji Katsura, Keisuke Yamakawa, Yosuke Komatsu, Masayoshi Tateno, Hideyuki Yukawa, Takashi Yamamoto
Publikováno v:
Transactions of the JSME (in Japanese). 87:21-00140
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::23cb034a5625bf1cd93202341082e2ea
https://doi.org/10.1299/transjsme.21-00140
https://doi.org/10.1299/transjsme.21-00140
Autor:
Masayoshi Tateno, Shunsuke Muraoka
Publikováno v:
MRS Advances. 5:1765-1774
Residual stress can considerably weaken systems with ceramics-to-metal joints. Herein, we investigate the dependence of bonding strength and residual stress variation of a ceramics-to-metal joint system on the interface wedge angle and bonding temper
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::810fa953dbf6a7c799a91362920ec6fb
https://doi.org/10.1557/adv.2020.156
https://doi.org/10.1557/adv.2020.156
Publikováno v:
Mechanical Engineering Journal, Vol 6, Iss 3, Pp 18-00561-18-00561 (2019)
This study investigates the effects of interface edge configuration on the stress distribution near the edge of a ceramics/metal joint system interface using numerical thermal elastoplastic analysis. Finite element bonded dissimilar models were emplo
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::693b3d37d19292d76b3960ffcc9b6e7f
https://doi.org/10.1299/mej.18-00561
https://doi.org/10.1299/mej.18-00561
Autor:
Takashi Tominaga, Masayoshi Tateno
Publikováno v:
Volume 6A: Materials and Fabrication.
This study provides effects of bonding temperature conditions on practical strength in ceramic to metal joint system made by two stages bonding process. Ceramic to metal joint system is required to reduce the residual stress near the edge of the inte
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::43cc35419a3f56e0432bae436df337bb
https://doi.org/10.1115/pvp2016-63914
https://doi.org/10.1115/pvp2016-63914
Publikováno v:
Journal of the Society of Materials Science, Japan. 61:119-124
The recent trend in circuit assemblies is to bond larger IC packages to PCB (Printed-circuit Board) by BGA (Ball Grid Array) solder joint and underfills. This would induce more intricate CTE (Coefficient of Thermal Expansion) mismatches among the PCB
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::68c16435f1754cc06693a1d640467f11
https://doi.org/10.2472/jsms.61.119
https://doi.org/10.2472/jsms.61.119
Publikováno v:
The Proceedings of Ibaraki District Conference. :204
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::24df750f1908033e462e1cf870ffb600
https://doi.org/10.1299/jsmeibaraki.2018.26.204
https://doi.org/10.1299/jsmeibaraki.2018.26.204