Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Masaya Kouda"'
Publikováno v:
2017 China Semiconductor Technology International Conference (CSTIC).
Currently Wafer Level Package(WLP) is one of famous package structure in mobile consumer electronics industry because of cost, size, density and electrical performance. Recently one of the famous smart phone have on-board new application processor wh
Publikováno v:
Colloid and Polymer Science. 282:1150-1154
The glass transition temperatures (Tg) of three kinds of poly(methyl methacrylate)-based copolymer emulsions having wide polymer compositions, which were prepared by emulsifier-free emulsion copolymerizations of methyl methacryalate with ethyl acryla
Publikováno v:
Colloid & Polymer Science; Aug2004, Vol. 282 Issue 10, p1150-1154, 1p