Zobrazeno 1 - 10
of 22
pro vyhledávání: '"Masaya Horino"'
Publikováno v:
IEEJ Transactions on Sensors and Micromachines. 129:426-429
The optical pickup of our Small-Form-Factor Optical Disc Drives (SFFODDs) requires a micro-objective whose profile is composed of two aspheric surfaces. However, it is difficult to fabricate a micro-objective with an arbitrary aspheric surface and hi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::13324385a63493a9225a070c1eedf702
https://doi.org/10.1541/ieejsmas.129.426
https://doi.org/10.1541/ieejsmas.129.426
Autor:
Masaya Horino, Kouji Kusada
Publikováno v:
Journal of the Robotics Society of Japan. 25:1172-1175
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cf030df7df1d378b9123882c7e121bb5
https://doi.org/10.7210/jrsj.25.1172
https://doi.org/10.7210/jrsj.25.1172
Autor:
Masaya Horino, Fumio Nitanda
Publikováno v:
Journal of the Japan Society for Precision Engineering, Contributed Papers. 72:791-795
A new mechanical fiber-optic switch and an optical fiber positioning structure for the switch were created in developing a lowloss, easy-to-assemble mechanical-optical switch. Experiments on the performance of trial productions were conducted: a new
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::683ea92074bec2125a4bafcd770cc2c6
https://doi.org/10.2493/jspe.72.791
https://doi.org/10.2493/jspe.72.791
Autor:
Ryoji Okada, Atsushi Kazama, Yasuhiro Itou, Teruhisa Akashi, Takeshi Harada, Masaya Horino, Kazuyuki Fukuda, Masatoshi Kanamaru, Tadaaki Ishikawa
Publikováno v:
Journal of Micromechanics and Microengineering. 15:1754-1761
An optical beam scanning array (OBSA) integrating two mirror arrays and a collimator-lens array was fabricated. The passive self-alignment inserting a pin into a through-hole was carried out for integration of the mirror arrays and the collimator-len
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::da6b669947e018ce46771e578a9e98b1
https://doi.org/10.1088/0960-1317/15/9/018
https://doi.org/10.1088/0960-1317/15/9/018
Publikováno v:
The Review of Laser Engineering. 33:727-731
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::784011a8d64a96de10d55d3f74aa52fe
https://doi.org/10.2184/lsj.33.727
https://doi.org/10.2184/lsj.33.727
Publikováno v:
TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series C. 70:3564-3571
A small, low-loss, easy-to-assemble mechanical-optical switch was developed. A series of trial productions of the switch were made and tested experimentally. These tests showed that the switch's insertion loss is 0.4 dB on average which varied less t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::57fca4584cffc135128a9401e2bb9d11
https://doi.org/10.1299/kikaic.70.3564
https://doi.org/10.1299/kikaic.70.3564
Autor:
Atsushi Kazama, Ryoji Okada, Teruhisa Akashi, Tadaaki Ishikawa, Masaya Horino, Takeshi Harada, Yasuhiro Itou, Kazuyuki Fukuda, Masatoshi Kanamaru
Publikováno v:
JSME International Journal Series B. 47:501-507
A three-dimensional (3D)-type MEMS optical switch with low insertion loss and low assembly cost has been developed. The switch consists of two optical beam scanners placed facing each other. Each scanner consists of a collimator array and two mirror
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f47f15fd39abd29de0953cdf16094e6f
https://doi.org/10.1299/jsmeb.47.501
https://doi.org/10.1299/jsmeb.47.501
Publikováno v:
Electronics and Communications in Japan (Part II: Electronics). 85:41-49
The optical switch is an essential and indispensable optical device in improving reliability and developing advanced functions in optical communications systems and occupies an extremely important position in the development of optical communications
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::aaa1c4357d8025547e18f73aed2aca8b
https://doi.org/10.1002/ecjb.1085
https://doi.org/10.1002/ecjb.1085
Publikováno v:
QUARTERLY JOURNAL OF THE JAPAN WELDING SOCIETY. 19:521-536
Thermal cycling of an electronic assembly produces repeated inelastic strains in solder joints, which may cause thermal fatigue cracks to initiate and grow in a solder. The stress-strain relationship, creep deformation and stress relaxation in 37Pb63
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a9cfb3483ad7ab364adc599f679649e9
https://doi.org/10.2207/qjjws.19.521
https://doi.org/10.2207/qjjws.19.521
Publikováno v:
Electronics and Communications in Japan (Part II: Electronics). 83:13-20
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f3daee8041e147f88ff2c4cdfbe193bc
https://doi.org/10.1002/(sici)1520-6432(200005)83:5<13::aid-ecjb2>3.0.co
https://doi.org/10.1002/(sici)1520-6432(200005)83:5<13::aid-ecjb2>3.0.co