Zobrazeno 1 - 10
of 11
pro vyhledávání: '"Masaya Gemma"'
Publikováno v:
International Journal of Engineering and Advanced Technology. 11:155-161
In this study, the main objective is to clarify the relationship between the material properties of the work material and the grooving properties for various work materials from hard and brittle materials to metallic materials. In this paper, in orde
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::78dc2870397e18d1a8ac3f83f958a647
https://doi.org/10.35940/ijeat.a3197.1011121
https://doi.org/10.35940/ijeat.a3197.1011121
Autor:
Kenji Yamaguchi, Tsuyoshi Fujita, Yasuo Kondo, Masaya Gemma, Keitoku Hayashi, Mitsugu Yamaguchi, Satoshi Sakamoto
Publikováno v:
Key Engineering Materials. 719:132-136
A wire tool having electrodeposited diamond grains is frequently used for machining hard and brittle materials such as silicon ingots, magnetic materials, ceramics, and sapphires. This study aims to examine the wear characteristics of the tool during
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3569c6622d7565925bf2caf3e527cbd1
https://doi.org/10.4028/www.scientific.net/kem.719.132
https://doi.org/10.4028/www.scientific.net/kem.719.132
Autor:
Tsuyoshi Fujita, Kenji Yamaguchi, Satoshi Sakamoto, Keitoku Hayashi, Yasuo Kondo, Masaya Gemma, Mitsugu Yamaguchi
Publikováno v:
Key Engineering Materials. 703:17-21
An electroplated diamond wire tool is frequently used for the machining of hard and brittle materials such as silicon ingots, magnetic materials, ceramics, and sapphires. This study aims to examine the influence of brittle behavior of work materials
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7ee9b2dc98f20322b11b2ad857061889
https://doi.org/10.4028/www.scientific.net/kem.703.17
https://doi.org/10.4028/www.scientific.net/kem.703.17
Publikováno v:
MATEC Web of Conferences, Vol 221, p 04005 (2018)
Multi-wire saws with a diamond electrodeposited wire tool are widely used to slice hard and brittle materials. The properties of the materials significantly affect the saw’s performance in terms of slicing quality, efficiency, and accuracy. In this
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::61d4b71c378c46155f890d27d1d6635e
https://doaj.org/article/49c140f8583f4085b682a58594fbf641
https://doaj.org/article/49c140f8583f4085b682a58594fbf641
Autor:
Takao Yakou, Yasuo Kondo, Satoshi Sakamoto, Kenji Yamaguchi, Sanshiro Akaoka, Mitsugu Yamaguchi, Masaya Gemma
Publikováno v:
MATEC Web of Conferences, Vol 221, p 04006 (2018)
The manufacturing costs of semiconductor products such as silicon wafers can be reduced by decreasing the kerf loss. In addition, a decrease in the kerf loss leads to an effective utilization of rare materials, which is environmentally beneficial fro
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::bf008854a4e3c60675a9dfb20700f8c6
https://doaj.org/article/388f37f0bd8b4256ba0c75af0a292118
https://doaj.org/article/388f37f0bd8b4256ba0c75af0a292118
Autor:
Satoshi Sakamoto, Sanshiro Akaoka, Masaya Gemma, Yasuo Kondo, Kenji Yamaguchi, Mitsugu Yamaguchi, Takao Yakou
Publikováno v:
MATEC Web of Conferences; 10/27/2018, Vol. 221, p1-4, 4p
Publikováno v:
MATEC Web of Conferences; 10/27/2018, Vol. 221, p1-4, 4p
Autor:
Yasuo Kondo, Susumu Arakawa, Keitoku Hayashi, Kenji Yamaguchi, Takao Yakou, Satoshi Sakamoto, Masaya Gemma
Publikováno v:
IOP Conference Series: Materials Science and Engineering. 229:012004
Thinning of silicon wafers and reduction of kerf loss can minimize the manufacturing costs of semiconductor products. Currently, the volume of kerf loss is about the same as the volume of the wafer itself. Therefore, we study slicing techniques for s
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3368846c3d8e453016f2bdfd58b88cae
https://doi.org/10.1088/1757-899x/229/1/012004
https://doi.org/10.1088/1757-899x/229/1/012004
Autor:
Susumu Arakawa, Satoshi Sakamoto, Keitoku Hayashi, Yasuo Kondo, Takao Yakou, Kenji Yamaguchi, Masaya Gemma
Publikováno v:
IOP Conference Series: Materials Science and Engineering. 229:012031
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::114ca7e87870d6f52a4f75a4c86762e4
https://doi.org/10.1088/1757-899x/229/1/012031
https://doi.org/10.1088/1757-899x/229/1/012031
Autor:
Satoshi Sakamoto, Keitoku Hayashi, Masaya Gemma, Yasuo Kondo, Kenji Yamaguchi, Takao Yakou, Susumu Arakawa
Publikováno v:
IOP Conference Series: Materials Science & Engineering; Sep2017, Vol. 229 Issue 1, p1-1, 1p