Zobrazeno 1 - 10
of 125
pro vyhledávání: '"Masatoshi Tokushima"'
Autor:
Tadashi Murao, Jun Ushida, Hiroyuki Takahashi, Masatoshi Tokushima, Akemi Shiina, Tsuyoshi Horikawa
Publikováno v:
Journal of Lightwave Technology. 40:5171-5189
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fa5dbadfd721c7cb0ae4e8247438618e
https://doi.org/10.1109/jlt.2022.3172288
https://doi.org/10.1109/jlt.2022.3172288
Autor:
Tsuyoshi Horikawa, Keizo Kinoshita, Yasuhiko Hagihara, Masatoshi Tokushima, Koichi Takemura, Takanori Shimizu, Daisuke Okamoto, Kenichiro Yashiki, Mitsuru Kurihara, Kazuhiko Kurata
Publikováno v:
Journal of The Japan Institute of Electronics Packaging. 22:551-558
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f13128d42c3d10e720e15390af63f239
https://doi.org/10.5104/jiep.22.551
https://doi.org/10.5104/jiep.22.551
Autor:
Kenji Mizutani, Yasuhiko Hagihara, Akio Ukita, Takaaki Nedachi, Junichi Fujikata, Masataka Noguchi, Daisuke Okamoto, Keizo Kinoshita, Hiroshi Yamaguchi, Mitsuru Kurihara, Tsuyoshi Horikawa, Takahiro Nakamura, Yasuyuki Suzuki, Yasuhiro Ibusuki, Jun Ushida, Takanori Shimizu, Koichi Takemura, Junichi Tsuchida, Kenichiro Yashiki, Masatoshi Tokushima, Kazuhiko Kurata
Publikováno v:
IEICE Transactions on Electronics. :333-339
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::87994fccaa4e042b9a08b78384c0e426
https://doi.org/10.1587/transele.2018odi0005
https://doi.org/10.1587/transele.2018odi0005
Autor:
Daisuke Ohshima, Masatoshi Tokushima, Akio Ukita, Akihiro Noriki, Takeru Amano, Koichi Takemura, Daisuke Okamoto, Daisuke Shimura, Jun Ushida, Tsuyoshi Aoki
Publikováno v:
2021 International Conference on Electronics Packaging (ICEP).
We propose silicon (Si)-photonics-embedded interposers to minimize the Si photonics chip size and achieve highly precise optical fiber alignment. The interposers are organic interposer substrates that have Si photonics transceiver dies buried in the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2f5065cda6f34eabbba863b02230f9cb
https://doi.org/10.23919/icep51988.2021.9451948
https://doi.org/10.23919/icep51988.2021.9451948
Autor:
Jun Ushida, Hiroyuki Takahashi, Tsuyoshi Horikawa, Akemi Shiina, Masatoshi Tokushima, Tadashi Murao
Publikováno v:
Silicon Photonics XVI.
This Conference Presentation, “Compact modeling and parametric extraction of phase shifters in carrier-depletion Mach-Zehnder silicon modulators,” was recorded for the Photonics West 2021 Digital Forum.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::eda943c9ae391d87812a1900bea2fa34
https://doi.org/10.1117/12.2577921
https://doi.org/10.1117/12.2577921
Autor:
Hiroyuki Takahashi, Tsuyoshi Horikawa, Akemi Shiina, Jun Ushida, Masatoshi Tokushima, Tadashi Murao
Publikováno v:
Optics Communications. 507:127645
Testing of active photonic devices is totally different from testing of pure electronics; in particular, reduction of testing time in silicon photonics has been a significant issue. In this study, a compact behavioral model of optical phase shifters
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0652fdb2ea7d93efe99fe37e38124c2a
https://doi.org/10.1016/j.optcom.2021.127645
https://doi.org/10.1016/j.optcom.2021.127645
Autor:
Yasuhiko Hagihara, Jun Ushida, Kenichiro Yashiki, Di Okamoto, Mitsuru Kurihara, Keizo Kinoshita, Yasuyuki Suzuki, Tsuyoshi Horikawa, T. Nakamura, Junichi Fujikata, Masatoshi Tokushima, Koichi Takemura, Kazuhiko Kurata
Publikováno v:
Web of Science
A chip-scale optical transceiver was developed based on silicon photonics technology and optical/electrical assembly for 25-Gbs× four -channel applications. Optical transmitters and receivers were integrated on a single silicon platform enabled by t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::eec7d22fb3af3053f9538b7371ddf0fd
https://doi.org/10.1109/vlsitechnology18217.2020.9265051
https://doi.org/10.1109/vlsitechnology18217.2020.9265051
Autor:
Koichi Takemura, Daisuke Ohshima, Akihiro Noriki, Daisuke Okamoto, Akio Ukita, Jun Ushida, Masatoshi Tokushima, Takanori Shimizu, Ichiro Ogura, Daisuke Shimura, Tsuyoshi Aoki, Takeru Amano, Takahiro Nakamura
Publikováno v:
Transactions of The Japan Institute of Electronics Packaging. 15:E21-012
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4fea72b85d6f88b260ed77b0eb1f200f
https://doi.org/10.5104/jiepeng.15.e21-012-1
https://doi.org/10.5104/jiepeng.15.e21-012-1
Autor:
Takahiro Nakamura, Koichi Takemura, Shigeki Takahashi, Jun Ushida, Yasuhiko Hagihara, Takanori Shimizu, Yohei Sobu, Keizo Kinoshita, Tsuyoshi Horikawa, Mitsuru Kurihara, Tohru Mogami, Yasuyuki Suzuki, Masatoshi Tokushima, Yu Tanaka, Junichi Fujikata, Akio Ukita, Daisuke Okamoto, Kazuhiko Kurata, Seok-Hwan Jeong, Kenichiro Yashiki
Publikováno v:
Journal of Lightwave Technology. 36:4701-4712
Optical transmitter and receiver ICs, each with a footprint of ${\text{25 mm}}^{2}$ , were fabricated using a silicon photonics platform based on 40-nm-node CMOS technology. High-speed transmissions of data at 300 Gbps were demonstrated. The wire-typ
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3b4a522b29ff84944e697bbb410e0b17
https://doi.org/10.1109/jlt.2018.2863779
https://doi.org/10.1109/jlt.2018.2863779
Publikováno v:
Journal of Lightwave Technology. 36:4783-4791
We experimentally demonstrated a post-integrated dual-core spot-size converter (SSC) that had a coupling end with a 10-μm diameter at the edge of an Si-photonics chip. Although there was an extra loss increase as a result of post-integration, it can
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4d453668445a5731682860c7727f79e2
https://doi.org/10.1109/jlt.2018.2863732
https://doi.org/10.1109/jlt.2018.2863732