Zobrazeno 1 - 1
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pro vyhledávání: '"Masato Ujiie"'
Publikováno v:
Transactions of The Japan Institute of Electronics Packaging. 2:62-68
In this study, 60 solder compositions were examined in an effort to improve the integrity against impact loads of the solder joints on an electroless Ni–P/Au surface finish. The Ag, Cu, and Ni contents in the Sn-based solder varied from 0 to 4.5 wt
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ea8f50cb3b1f792fb89a81d5e2d9f2eb
https://doi.org/10.5104/jiepeng.2.62
https://doi.org/10.5104/jiepeng.2.62
