Zobrazeno 1 - 6
of 6
pro vyhledávání: '"Masato Takamori"'
Autor:
Kinya Ohata, Noriko Iwaki, Ken Ishiyama, Hirohito Yamazaki, Shinji Nakao, Mitsuhiro Kawano, Tatsuya Imi, Takashi Nakamura, Noriharu Nakagawa, Hiroyuki Takamatsu, Kiyoaki Ito, Masato Takamori, Yukio Kondo, Go Aoki, Kohei Hosokawa
Publikováno v:
International Journal of Hematology
Although some studies have suggested the effectiveness of hyperbaric oxygen (HBO) therapy for hemorrhagic cystitis (HC) after allogeneic hematopoietic stem cell transplantation (HSCT), the role of HBO has not been established. We compared the treatme
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::94b57c936a2a5aa60d41e4f740272e38
https://doi.org/10.1007/s12185-021-03120-y
https://doi.org/10.1007/s12185-021-03120-y
Common Metal Die Attachment for SiC Power Devices Operated in an Extended Junction Temperature Range
Autor:
Yoshinori Murakami, Satoshi Tanimoto, Shinji Sato, Yusuke Zushi, Kohei Matsui, Masato Takamori, Takashi Iseki
Publikováno v:
Materials Science Forum. :853-856
A new high-temperature die attachment system that is cost effective has been strongly desired for SiC power applications in electric vehicles and consumer electronics. This paper presents preliminary results for SiC/Zn-Al/Cu-SiN die attachments using
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6b011fb1e8508be88bc09d12fdf9f7df
https://doi.org/10.4028/www.scientific.net/msf.717-720.853
https://doi.org/10.4028/www.scientific.net/msf.717-720.853
Autor:
Masato Takamori, Takashi Iseki
Publikováno v:
Journal of Japan Institute of Electronics Packaging. 15:153-157
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::68c223d02a5765870e98f5d2d971714e
https://doi.org/10.5104/jiep.15.153
https://doi.org/10.5104/jiep.15.153
Autor:
Masato Takamori
Publikováno v:
The Japanese Journal of Gastroenterological Surgery. 23:2244-2250
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::435d73443f6523b8a0f16f5defb922bd
https://doi.org/10.5833/jjgs.23.2244
https://doi.org/10.5833/jjgs.23.2244
Autor:
Satoshi Tanimoto, Kohei Matsui, Yusuke Zushi, Shinji Sato, Yoshinori MurakamiA, Masato Takamori, Takashi Iseki
Publikováno v:
Journal of Microelectronic & Electronic Packaging; 2013 2nd Quarter, Vol. 10 Issue 2, p59-66, 8p
Autor:
Takashi Iseki, Shinji Sato, Masato Takamori, Yoshinori Murakami, Yusuke Zushi, Kohei Matsui, Satoshi Tanimoto
Publikováno v:
Scopus-Elsevier
This paper comprehensively describes the fabrication method and shear strength reliability of a eutectic Zn-Al (m.p. = 382°C) attachment system, built by soldering SiC dice (2 × 2 mm2) onto Cu foil active-metal-brazed with a SiN ceramic plate. Four
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::0774f89b89a275006d789e20dd0bd767
http://www.scopus.com/inward/record.url?eid=2-s2.0-84876739070&partnerID=MN8TOARS
http://www.scopus.com/inward/record.url?eid=2-s2.0-84876739070&partnerID=MN8TOARS
