Zobrazeno 1 - 10
of 41
pro vyhledávání: '"Masataka Hoshino"'
Autor:
Eiji Hiraoka, Yasuhiro Norisue, Masataka Hoshino, Natsumi Tanabe, Kana Sawada, Jumpei Tsukuda, Gautam A. Deshpande, Toshihiko Suzuki
Publikováno v:
The American Journal of Case Reports
Patient: Female, 49 Final Diagnosis: Cerebral venous thrombosis Symptoms: Altered mental state • weakness in limbs Medication: — Clinical Procedure: — Specialty: Endocrinology and Metabolic Objective: Rare co-existance of disease or pathology B
Autor:
Shuji Inoue, Yuuichi Maeda, Masataka Hoshino, Yoshitaka Kajimoto, Susumu Shimura, Yukari Soejima, Toshiyuki Ogata
Publikováno v:
Nippon Eiyo Shokuryo Gakkaishi. 65:261-270
Autor:
Shigeki Marubuchi, Ichiro Kanazawa, Giovanni Blandino, Marius Sudol, Kiyomitsu Oyanagi, Masataka Hoshino, Minoru Saitoe, Tomoyuki Miyashita, Mei Ling Qi, Natsue Yoshimura, Kazuhiko Tagawa, Hitoshi Okazawa, Yasushi Enokido, Tina Rich, Yo Ichi Wada, Phoebe Harjes, Erich E. Wanker, Nobutaka Arai
Publikováno v:
The Journal of Cell Biology
Transcriptional disturbance is implicated in the pathology of polyglutamine diseases, including Huntington's disease (HD). However, it is unknown whether transcriptional repression leads to neuronal death or what forms that death might take. We found
Autor:
Ichiro Kanazawa, Yunglong Qi, Yo-ichi Wada, Kenichi Shinomiya, Natsue Yoshimura, Masataka Hoshino, Shigeki Marubuchi, Hitoshi Okazawa
Publikováno v:
European Journal of Neuroscience. 22:1277-1286
Summary Mutations of PQBP-1 (polyglutamine binding protein-1) have been shown recently to cause human mental retardation accompanied by microcephaly at a high frequency. As a first step towards understanding the molecular basis of this developmental
Autor:
Seung Jin Oh, Takuji Okamura, Masataka Hoshino, Kazuo Kondo, Manabu Tomisaka, Kenji Takahashi, Hitoshi Yonemura, Jian-Jun Sun
Publikováno v:
Journal of the Electrochemical Society. 152(11):173-177
Through-chip electrodes for three-dimensional packaging can offer short interconnection and reduced signal delay. Formation of suitable vias by electrodeposition into cavities presents a filling problem similar to that encountered in the damascene pr
Autor:
Kazumasa Tanida, Yuichi Taguchi, Toshihiro Yonezawa, Masataka Hoshino, Kenji Takahashi, Kazuo Kondo, Mitsuo Umemoto
Publikováno v:
Electronics and Communications in Japan (Part II: Electronics). 88:50-60
Three-dimensional chip stacking with through-vias is a very promising technology in semiconductor system development. A major problem of this technology is the cost. We analyzed the costs of the fabrication process and identified the three processes
Autor:
Hitoshi Okazawa, Sabine Engemann, Erich E. Wanker, Hiroko Ueda, Masumi Ichikawa, Tomohiro Okuda, Hiroshi Hayashi, Haruo Okado, Masataka Hoshino, Kazuhiko Tagawa
Publikováno v:
Journal of Neurochemistry. 89:974-987
Aggregation of disease proteins is believed to be a central event in the pathology of polyglutamine diseases, whereas the relationship between aggregation and neuronal death remains controversial. We investigated this question by expressing mutant hu
Autor:
Hitoshi Okazawa, Kiyomitsu Oyanagi, Toshio Mizutani, Tomohiro Okuda, Nobutaka Arai, Ichiro Kanazawa, Miho Murata, Kazuhiko Tagawa, Masataka Hoshino, Erich E. Wanker
Publikováno v:
Journal of Neurochemistry. 87:257-267
Perturbation of histone acetyl-transferase (HAT) activity is implicated in the pathology of polyglutamine diseases, and suppression of the counteracting histone deacetylase (HDAC) proteins has been proposed as a therapeutic candidate for these intrac
Autor:
Takuji Okamura, Yuichi Taguchi, Kenji Takahashi, Hitoshi Yonemura, Toshihiro Yonezawa, Masataka Hoshino, Kazuo Kondo, Seung Jin Oh, Manabu Tomisaka
Publikováno v:
Journal of Japan Institute of Electronics Packaging. 6:596-601
Through chip electrodes with high aspect ratios used for three dimensional packaging can offer the shortest interconnection and reduce signal delay. Copper has good compatibility to conventional multi layer interconnection in LSI and BEOL (back end o
Autor:
Masataka Hoshino
Publikováno v:
Journal of the Surface Finishing Society of Japan. 52:479-483