Zobrazeno 1 - 4
of 4
pro vyhledávání: '"Masashi Okaniwa"'
Autor:
Katsutoshi Ihara, Masashi Okaniwa, Kohei Higashiguchi, Takahito Sekido, Tsuyoshi Kida, Shu Yoshida
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 10:11-17
Internet of Things (IoT) accelerated by the rapid progress of 5G is bringing a lot of challenges to semiconductor packaging technologies. In particular, flip-chip bonding technology is strongly required to realize ultrafine-pitch products, such as ne
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7d92e65ebd8c7f1f4a7d4c006875ddea
https://doi.org/10.1109/tcpmt.2019.2950697
https://doi.org/10.1109/tcpmt.2019.2950697
Autor:
Kohei Higashiguchi, Kentaro Takano, Genki Sugiyama, Masashi Okaniwa, Hiroki Yamazaki, Yoshiyasu Kaimori, Tsuyoshi Kida, Kojiro Abe
Publikováno v:
2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC).
TCB (Thermal Compression Bonding) with NCF (Non Conductive Film) is expected as an effective solution to realize fine pitch interconnections, however, the actual production volume is still small due to its low productivity. Although some multiple die
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6b1278c38d91af1d4b78a81271e1fd21
https://doi.org/10.1109/estc48849.2020.9229782
https://doi.org/10.1109/estc48849.2020.9229782
Autor:
Kohei Higashiguchi, Katsutoshi Ihara, Tsuyoshi Kida, Takahito Sekido, Shu Yoshida, Masashi Okaniwa, Takenori Takiguchi, Toyoji Oshima
Publikováno v:
2018 7th Electronic System-Integration Technology Conference (ESTC).
TCB (Thermal Compression Bonding) process with NCF (Non Conductive Film) is expected as an effective solution for fine pitch applications brought by the progress of IoT (Internet of Things), however the production volume is limited to small level bec
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0041486157426a30651751f9849ab18e
https://doi.org/10.1109/estc.2018.8546397
https://doi.org/10.1109/estc.2018.8546397
Autor:
Tsuyoshi Kida, Kohei Higashiguchi, Shu Yoshida, Toyoji Oshima, Takenori Takiguchi, Masashi Okaniwa, Katsutoshi Ihara
Publikováno v:
2017 IEEE 67th Electronic Components and Technology Conference (ECTC).
This study investigated the relations between base resins and flux compounds applied to NCF (Non Conductive film) for thermal compression bonding with micro Cu pillar bumps. As the use of NCF expands, outgas during flip-chip bonding process is being
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::17e51ae63191e2e8ed543d0fd2719247
https://doi.org/10.1109/ectc.2017.126
https://doi.org/10.1109/ectc.2017.126