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pro vyhledávání: '"Masashi Nogawa"'
Autor:
Koji Yamada, Tai Tsuchizawa, Hidetaka Nishi, Hiroshi Fukuda, Mitsuo Usui, Tsuyoshi Yamamoto, Masashi Nogawa, Kentaro Honda, Tatsuro Hiraki, Rai Kou, Hirooki Hirata, Kotaro Takeda
Publikováno v:
2015 International Conference on Electronic Packaging and iMAPS All Asia Conference (ICEP-IAAC).
We propose a new solder-free and low-temperature (200 °C or less) flip-chip integration technology for silicon photonic platforms. Au stud bumps are arranged facing each other on a substrate and a chip. Plastic deformation when the bumps are heated
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::36b4acbf51f6b2b36bec4469add123cd
https://doi.org/10.1109/icep-iaac.2015.7111096
https://doi.org/10.1109/icep-iaac.2015.7111096
