Zobrazeno 1 - 10
of 378
pro vyhledávání: '"Masaru ISHIZUKA"'
Publikováno v:
Journal of Thermal Science and Technology, Vol 15, Iss 3, Pp JTST0032-JTST0032 (2020)
The SPICE model of phase change material (PCM) for thermal network transient calculation was investigated. The nonlinear behavior of PCM due to latent heat was modeled by using the voltage dependent current source and the capacitor. A latent heat is
Externí odkaz:
https://doaj.org/article/e9003d89c90d4367ae7d05209878a63d
Publikováno v:
Journal of Thermal Science and Technology, Vol 6, Iss 1, Pp 164-177 (2011)
This paper describes the results of experimental and analytical work on a phase-changematerial(PCM)-based transient cooling module. The module is made of low-cost materials, yet it is designed to achieve a reasonably high level of heat transfer perfo
Externí odkaz:
https://doaj.org/article/2a1f01541c5149e9a2b99d2b9cb65bfe
Publikováno v:
Journal of Thermal Science and Technology, Vol 4, Iss 3, Pp 372-381 (2009)
The cooling capability in compact electronic equipment of natural convective flow fields was investigated. A relationship between air passage width in the channel and natural cooling capability was obtained. Temperature and velocity measurements were
Externí odkaz:
https://doaj.org/article/1ada711c1a3c400b9eb4c4c128730fd6
Publikováno v:
International Journal of Rotating Machinery, Vol 6, Iss 6, Pp 433-444 (2000)
In the present work, the flow and temperature fields in large scale rotating electric motor are studied by solving the Navier–Stokes equations along with the temperature equation on the basis of finite difference method. All the equations are writt
Externí odkaz:
https://doaj.org/article/5c021c5948974ec881d10bf57f0c3c32
Publikováno v:
Active and Passive Electronic Components, Vol 2011 (2011)
In recent years, there is a growing demand to have smaller and lighter electronic circuits which have greater complexity, multifunctionality, and reliability. High-density multichip packaging technology has been used in order to meet these requiremen
Externí odkaz:
https://doaj.org/article/3222af4b7f8644cca4a103dfcc3c1bb5
Publikováno v:
Journal of The Japan Institute of Electronics Packaging. 25:123-132
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::86b6bcd38853753ea5e468aa4372d682
https://doi.org/10.5104/jiep.jiep-d-20-00094
https://doi.org/10.5104/jiep.jiep-d-20-00094
Autor:
Masaru Ishizuka
Publikováno v:
Proceeding of Proceedings of Symposium on Energy Engineering in the 21st Century (SEE2000) Volume I-IV.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::67ec56293d0d87012389217b802c80fc
https://doi.org/10.1615/see2000.340
https://doi.org/10.1615/see2000.340
Autor:
Masaru Ishizuka
Publikováno v:
Proceeding of Compact Heat Exchangers and Enhancement Technology for the Process Industries - 2003.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e4a8930511119a59e8c758898293b690
https://doi.org/10.1615/978-1-56700-195-2.450
https://doi.org/10.1615/978-1-56700-195-2.450
Publikováno v:
Proceeding of Transport Phenomena in Thermal Engineering. Volume 2.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::95bf47149dc45147907c5f5fad444f88
https://doi.org/10.1615/istp-vi.660
https://doi.org/10.1615/istp-vi.660
Publikováno v:
2022 International Conference on Electronics Packaging (ICEP).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3a3d4f5f6bfc2c8a6c6d47a191e310ce
https://doi.org/10.23919/icep55381.2022.9795618
https://doi.org/10.23919/icep55381.2022.9795618