Zobrazeno 1 - 10
of 16
pro vyhledávání: '"Masaru Bunya"'
Autor:
Kazuho Ashizawa, Kazuyuki Matsushita, Syota Murata, Koji Watanabe, Takashi Terada, Sachio Tsuchida, Yoko Teruuchi, Fumio Nomura, Mamoru Satoh, Daisuke Ito, Masaru Bunya, Motoi Nishimura, Yuji Sugama
Publikováno v:
Journal of Microbiological Methods. 139:54-60
Matrix-assisted laser desorption ionization time-of-flight mass spectrometry (MALDI-TOF MS) can be used to identify pathogens in blood culture samples. However, sample pretreatment is needed for direct identification of microbes in blood culture bott
Autor:
Masaru Bunya, Yasutaka Yamada, Masayuki Yokoi, Minoru Takeuchi, Naoki Okamoto, Takeyasu Saito, Kazuo Kondo
Publikováno v:
Journal of Japan Institute of Electronics Packaging. 18:245-252
Autor:
Kazuo Kondo, Takeyasu Saito, Minoru Takeuchi, Naoki Okamoto, Masaru Bunya, Shoko Okada, Yoshihiro Anami, Masayuki Yokoi, Yasutaka Yamada
Publikováno v:
Electrochemistry. 82:430-437
Autor:
Naoki Okamoto, Takeyasu Saito, Masaru Bunya, Masayuki Yokoi, Taro Hayashi, Kazumoto Kondo, Minoru Takeuchi
Publikováno v:
ECS Transactions. 50:29-37
To enable low power consumption and the access speed increase,three dimensional packaging of semiconductor chips has beenproposed. In particular, a high-aspect ratio through silicon via(TSV)allows short chip to chip interconnection. 4 μm diameter an
Autor:
Masao Marunaka, Masaru Bunya, Takayuki Tsuchiya, Masayuki Yokoi, Takeyasu Saito, Taro Hayashi, Minoru Takeuchi, Naoki Okamoto, Kazuo Kondo
Publikováno v:
Journal of The Electrochemical Society. 160:D256-D259
Autor:
Kazuo Kondo, Yasutaka Yamada, Y. Yokoi, Masaru Bunya, Takeyasu Saito, Minoru Takeuchi, Naoki Okamoto
Publikováno v:
Journal of The Electrochemical Society. 160:D3110-D3115
We achieved the bottom-up via-filling by copper electrodeposition using a single diallylamine-type copolymer additive instead of the four types of additives, Suppressor Leveler Accelerator and Chloride ions. We newly synthesized and used four additiv
Publikováno v:
ECS Transactions. 41:35-41
Which Perfectly Fills Cu Electrodeposition with only 1ppm K.Kondo,M. Takeuchi, , H. Kuri, M. Bunya, N. Okamoto, T. Saito Department of Chemical Engineering, Graduate School of Engineering, Osaka Prefecture University, 1-1 Gakuen-Cho, Naka-Ku, Sakai-S
Autor:
Masaru Bunya, Kazuo Kondo, Taro Hayashi, Yushi Suzuki, Minoru Takeuchi, Takayuki Tsuchiya, Masao Marunaka, Takeyasu Saito, Naoki Okamoto
Publikováno v:
ECS Transactions. 41:45-51
High-speed copper electrodeposition is needed to optimize the TSV process with a high throughput. To inhibit electrodeposition on the top surface of the TSV, the ODT was microcontact-printed on the top surface. The ODT microcontact-printing effective
Publikováno v:
Journal of The Electrochemical Society. 159:D230-D234
Autor:
Yusuke Shimizu, Martin J. Stillman, Masaru Bunya, Satoshi Ito, Tetsuo Okujima, Noboru Ono, Hiroki Uoyama, John Mack, Hidemitsu Uno, Naoki Komobuchi, Nagao Kobayashi
Publikováno v:
Chemistry - A European Journal. 14:5001-5020
The optical spectra of a series of core-modified tetrabenzoporphyrins were analyzed to determine the effects of core modification, ligand folding, and partial benzo substitution at the ligand periphery on the electronic structure by using magnetic ci