Zobrazeno 1 - 10
of 22
pro vyhledávání: '"Masanori Usui"'
Publikováno v:
IEEE Transactions on Power Electronics. 36:11739-11747
The aim of this article is to elucidate the short-circuit failure mechanism of SiC metal–oxide–semiconductor field-effect transistors that cause mechanical failure of the interlayer dielectric adjacent to the gate, to find the relationship betwee
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f4ccb73b035b7f5cd2662fed9a338d5f
https://doi.org/10.1109/tpel.2021.3073991
https://doi.org/10.1109/tpel.2021.3073991
Publikováno v:
JOM. 73:600-608
The influence of thermal cycle stress loading on hybrid bonding, which was formed by sintering a mixture of Cu nanoparticles and a eutectic Bi-Sn solder powder, has been investigated. A Si chip and a directly bonded aluminum (DBA) substrate were bond
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e3157f404dd9b4fb290985724fcf7444
https://doi.org/10.1007/s11837-020-04521-w
https://doi.org/10.1007/s11837-020-04521-w
Publikováno v:
Journal of Materials Science: Materials in Electronics. 31:21389-21398
In this study, an effect of Al layer insertion to die-attach Ni–Sn joints with semiconductor chips by solid–liquid interdiffusion bonding on the stress and thermal cycling durability was investigated focusing on the purity of Al. The results show
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d3a50d973189fd36e7e88f6fc939c3c7
https://doi.org/10.1007/s10854-020-04651-6
https://doi.org/10.1007/s10854-020-04651-6
Autor:
Toshikazu Satoh, Masanori Usui
Publikováno v:
Journal of Materials Science: Materials in Electronics. 31:6547-6559
In this study, the effect of Bi–Sn composition on the bonding strength of Zn-mixed hybrid joints composed of SiC/Cu and SiC/direct bonded copper (DBC) was examined. For both joints, the bonding strength exhibited a similar dependence on Bi–Sn com
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::116dfdf20589e0d198246b32fa26e91d
https://doi.org/10.1007/s10854-020-03211-2
https://doi.org/10.1007/s10854-020-03211-2
Publikováno v:
Journal of Alloys and Compounds. 788:338-344
Zn powder was mixed with Cu nanoparticle joints by applying a very low additional pressure of 20 kPa to improve the bonding strength. Cu-Zn alloying throughout the bonding layer was achieved by firing at 623 K for 5 min. The phase composition of the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::709ad634759a54ff6e9de5916954d480
https://doi.org/10.1016/j.jallcom.2019.02.249
https://doi.org/10.1016/j.jallcom.2019.02.249
Publikováno v:
IET Power Electronics. 12:492-497
Highly reliable operation at high temperatures is required for next-generation power modules in electric vehicles. We propose a joining concept involving nickel–tin (Ni–Sn) double solid–liquid interdiffusion with an aluminium (Al) sheet (Ni–S
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::64151623c245c5c6b872c300f6c186ef
https://doi.org/10.1049/iet-pel.2018.5590
https://doi.org/10.1049/iet-pel.2018.5590
Effect of zinc particle mixing on properties of copper–nanoparticle/bismuth–tin solder hybrid joints
Autor:
Masanori Usui, Toshikazu Satoh
Publikováno v:
Journal of Materials Science: Materials in Electronics. 29:20415-20423
The effects of Zn particle mixing into a Cu–nanoparticle/Bi–Sn solder hybrid bonding were examined. The bonding strength of an SiC/direct-bonded-copper joint exhibited limited dependence on the Zn mixing ratio, whereas that of an SiC/Cu joint inc
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::22522f8d0ce8807f1e10498766c251ea
https://doi.org/10.1007/s10854-018-0175-x
https://doi.org/10.1007/s10854-018-0175-x
Publikováno v:
Journal of Materials Science: Materials in Electronics. 29:7161-7176
The effect of the diameter of Bi–Sn alloy particles on the bonding strength of hybrid joints formed between SiC chips and direct-bonded copper (DBC) plates using a Cu nanoparticles/Bi–Sn solder was studied. The bonding strength was the highest at
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c61eebec3a476dacdb73a5896012ff51
https://doi.org/10.1007/s10854-018-8704-1
https://doi.org/10.1007/s10854-018-8704-1
Autor:
Satomi Tajima, Yujiro Hayashi, Daigo Setoyama, Masanori Usui, Toshikazu Satoh, Masashi Kato, Hidehiko Kimura
Publikováno v:
Microelectronics Reliability. 78:93-99
The effects of high-temperature aging on a novel hybrid bonding layer were investigated. The hybrid layer, which consisted of Cu nanoparticles and a eutectic Bi-Sn solder powder, was formed by a sintering reaction of the solid-phase Cu nanoparticles
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6a65bde0a96a5cb9dec7d6a70c9e7592
https://doi.org/10.1016/j.microrel.2017.07.096
https://doi.org/10.1016/j.microrel.2017.07.096
Publikováno v:
Microelectronics Reliability. :405-408
Al2O3 chips and pure Cu plates were joined by Cu nanoparticles at 250 °C and 350 °C, and the Young's moduli of the sintered Cu were evaluated by nanoindentation tests. The average Young's moduli were 52.7 ± 19.8 GPa and 76.5 ± 29.7 GPa at 250 °C
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0187ff960dbe25a85f64fc9f8832f2b7
https://doi.org/10.1016/j.microrel.2017.06.015
https://doi.org/10.1016/j.microrel.2017.06.015