Zobrazeno 1 - 10
of 110
pro vyhledávání: '"Masanori Kajihara"'
Autor:
Minho O, Masanori Kajihara
Publikováno v:
Metals, Vol 13, Iss 10, p 1780 (2023)
This study focuses on the practical relevance of the Al-Ag bonding interface in electronic device fabrication, particularly in wire bonding, which is crucial for enhancing component reliability and performance. Experiments involved Al/Ag/Al diffusion
Externí odkaz:
https://doaj.org/article/ca11e00241da49a19105493cee83540f
Publikováno v:
Tetsu-to-Hagane. 108:370-382
Publikováno v:
Tetsu-to-Hagane. 108:41-53
Publikováno v:
MATERIALS TRANSACTIONS. 61:1740-1749
Publikováno v:
MATERIALS TRANSACTIONS. 60:895-901
Publikováno v:
MATERIALS TRANSACTIONS. 59:1872-1877
Publikováno v:
Scripta Mater.. 138:105-108
Very fine duplex microstructure composed of recrystallized-ferrite and reversed-austenite was developed by prior cold rolling and subsequent intercritical annealing in binary Fe-Ni alloys. The equilibrium austenite fraction in the recrystallized-ferr
Publikováno v:
MATERIALS TRANSACTIONS. 56:30-39
Autor:
Jaber Derakhshandeh, Andy Miller, Fuya Nagano, Inge De Preter, Myriam Van De Peer, Lin Hou, Gerald Beyer, Kenneth June Rebibis, S. H. Sharifi, Masanori Kajihara, Eric Beyne
Publikováno v:
2017 IEEE International Interconnect Technology Conference (IITC).
In this study we discuss superiority of Cobalt for using in 3D interconnection as alternative metal to Cu. Specimens composed of pure Sn and Co or Cu is aged under same aging condition varied time and temperature below melting point of Sn. Thickness
Autor:
Misako Nakayama, Masanori Kajihara
Publikováno v:
MATERIALS TRANSACTIONS. 55:1266-1273