Zobrazeno 1 - 7
of 7
pro vyhledávání: '"Masanobu Tsujimoto"'
Autor:
Kyoko Hamasaki, Shijo Nagao, Masanobu Tsujimoto, Katsuaki Suganuma, Tohru Sugahara, Jung-Lae Jo
Publikováno v:
Journal of Electronic Materials. 43:1-8
In this study, the morphological development of electroplated matte Sn and Sn-xBi (x = 0.5 wt.%, 1.0 wt.%, 2.0 wt.%) film surfaces was investigated under diverse testing conditions: 1-year room-temperature storage, high temperature and humidity (HTH)
Publikováno v:
Journal of Materials Science: Materials in Electronics. 24:3897-3904
Whisker growths from matte tin electroplating have been observed during thermal cycling up to 1,000 cycles either in air or in vacuum. The density, length, and width of thermal stress whiskers depend on the plating thickness of 2 and 5 μm in the pre
Autor:
Katsuaki Suganuma, Sun-Sik Kim, Keun-Soo Kim, Isamu Yanada, Masanobu Tsujimoto, Yuuhi Yorikado
Publikováno v:
Journal of Alloys and Compounds. 558:125-130
The establishment of lead-free plating technology and countermeasures for whisker formation are some of the critical issues remaining to be solved for lead-free electronics packaging. This study examined a method for mitigating Sn whisker formation b
Autor:
Keun-Soo Kim, Katsuaki Suganuma, Tohru Sugahara, Jung-Lae Jo, Shijo Nagao, Kyoko Hamasaki, Masanobu Tsujimoto
Publikováno v:
Journal of Materials Science: Materials in Electronics. 24:3108-3115
Long term surface evolution of matte tin electroplating has been investigated under room temperature to understand the tin whisker mitigation by a trace amount of lead addition. No whisker growth has been observed on all the Sn–xPb samples (1 ≤ x
Autor:
Shih Kang Lin, Yuhi Yorikado, Isamu Yanada, Katsuaki Suganuma, Junxiang Jiang, Keun-Soo Kim, Sinn-wen Chen, Masanobu Tsujimoto
Publikováno v:
Journal of Materials Research. 22:1975-1986
In this study, we investigated mechanical deformation-induced Sn whisker growth, which is frequently encountered in advanced flexible substrate packaging. Concentrated compressive stresses are introduced around the leads and solder surface finish joi
Autor:
Sinn-wen Chen, Katsuaki Suganuma, Yuhi Yorikado, Masanobu Tsujimoto, Junxiang Jiang, Shih Kang Lin, Keun-Soo Kim, Isamu Yanada
Publikováno v:
Journal of Electronic Materials. 36:1732-1734
The development of the microstructure of mechanical-deformation-induced Sn whiskers on electroplated films has been examined using a focused ion beam system (FIB). The 6-μm-thick matte Sn films were compressed by using a ZrO2 ball indenter under amb
Publikováno v:
2012 4th Electronic System-Integration Technology Conference.
Tin whiskers have seriously affected electric circuit reliability although tin is the most common metal used as electroplating on various electronic devices. Tin whiskers have caused short circuits resulting in misoperation of electric devices. Altho