Zobrazeno 1 - 10
of 17
pro vyhledávání: '"Masanobu Kohara"'
Publikováno v:
The Review of Laser Engineering. 33:181-188
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c9e806783ba055c501db85dec95c5dd3
https://doi.org/10.2184/lsj.33.181
https://doi.org/10.2184/lsj.33.181
Autor:
Ryoichi Yamasaki, Masanobu Kohara
Publikováno v:
Journal of SHM. 10:23-28
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4283899ad876575a3caa2feb42dd0096
https://doi.org/10.5104/jiep1993.10.5_23
https://doi.org/10.5104/jiep1993.10.5_23
Publikováno v:
IEEE Transactions on Components, Hybrids, and Manufacturing Technology. 16:592-597
To adjust the resistance of thick-film resistors (TFRs) buried in polyimide film, a process using a laser is proposed. Short-duration pulses from an Nd:YAG laser are used to irradiate the TFRs through the polyimide film. The TFR surface is modified t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3e49a60e4398867f51d0fe14bb59b77b
https://doi.org/10.1109/33.241784
https://doi.org/10.1109/33.241784
Publikováno v:
IEEE Transactions on Components, Hybrids, and Manufacturing Technology. 13:401-406
A small and thin quad flat package (QFP)-type plastic package for large-scale integrated (LSI) logic devices with high pin counts has been developed. The size of the package with 252 input and output pins is 17.3 mm by 17.3 mm, and the thickness is 1
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::652905a1e5fdbdad9e87078d60b03854
https://doi.org/10.1109/33.56175
https://doi.org/10.1109/33.56175
Publikováno v:
IEEE Transactions on Components, Hybrids, and Manufacturing Technology. 13:873-878
The mechanism of electromigration between the inner leads of large-scale integrated (LSI) chips in ceramic packages that are coated by thick polyimides to prevent alpha-particle-induced soft errors is discussed. Short-circuit failures between neighbo
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4bb7fff937a2ba87bc220214346ed19a
https://doi.org/10.1109/33.62532
https://doi.org/10.1109/33.62532
Publikováno v:
1991 Proceedings 41st Electronic Components & Technology Conference.
A novel manufacturing technology of buried RuO/sub 2/-based thick-film resistor (TFR) in copper-polyimide system has been studied. Since electrodes of copper thin film are formed on the TFR by using photolithography and a plating method and the resis
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f8e52fdf978eac77a1b727bed499f660
https://doi.org/10.1109/ectc.1991.163927
https://doi.org/10.1109/ectc.1991.163927
Autor:
Hiroshi Kurokawa, Kurumi Miyake, Mori Mitsumasa, Masahiro Nunoshita, Yoshiyuki Morihiro, Masanobu Kohara
Publikováno v:
MRS Proceedings. 227
A polyimide (PI) surface is analyzed by XPS at each electroless-copper-plating step. Zn ions are adsorbed on the PI surface, and subsequently replaced with Pd ions. Cu is deposited on the PI surface catalyzed by these Pd ions, As the surface concentr
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7f01462154694989525305f005744c61
https://doi.org/10.1557/proc-227-357
https://doi.org/10.1557/proc-227-357
Publikováno v:
Microelectronics Reliability. 31:1059
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::54b0f1cfd5c3e6c8428673bb98129b50
https://doi.org/10.1016/0026-2714(91)90195-d
https://doi.org/10.1016/0026-2714(91)90195-d
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