Zobrazeno 1 - 10
of 43
pro vyhledávání: '"Masamoto Tanaka"'
Publikováno v:
Journal of The Japan Institute of Electronics Packaging. 17:189-197
Publikováno v:
Materials Science Forum. :829-832
The thickness-ratio effects of Ni/Nb bi-layer electrodes were studied for power device applications. The reaction microstructure and electrical contact property were investigated after annealing at 1000 °C and compared with the results of an Ni elec
Publikováno v:
Journal of Electronic Materials. 33:321-328
The mechanical shear fatigue test has been performed to study the effect of silver content on the fatigue properties of Sn-xAg-0.5Cu (x=1, 2, 3, and 4) for flip-chip interconnections. The strength of the solder alloy increases with increasing silver
Publikováno v:
MATERIALS TRANSACTIONS. 45:1383-1390
The formation of fine Sn grains in a Sn-1.2 mass%Ag-0.5 mass%Cu-0.05 mass%Ni solder due to thermal strain was investigated from the viewpoint of recrystallization. After thermal fatigue, small general grains recrystallized at the strain concentrated
Publikováno v:
MATERIALS TRANSACTIONS. 45:673-680
The thermal fatigue properties of Sn-1.2Ag-0.5Cu (in mass%) flip chip interconnect were improved by a small amount of nickel addition. The thermal fatigue resistance of Sn-xAg-0.5Cu flip chip interconnects was enhanced byaddition of 0.05 mass%Ni, and
Publikováno v:
MATERIALS TRANSACTIONS. 45:689-694
The straddle fatigue test has been performed to study the fatigue properties of Sn-1.2 mass%Ag-0.5 mass%Cu-0.05 mass%Ni for flip chip interconnections. The low cycle fatigue resistance of the alloy is equivalent to that of Sn-3 mass%Ag-0.5 mass%Cu al
Autor:
Shinichi Terashima, Masamoto Tanaka
Publikováno v:
MATERIALS TRANSACTIONS. 45:681-688
Thermal fatigue properties of Sn-1.2Ag-0.5Cu-xNi (x: 0.02, 0.05, 0.10 and 0.20 mass%) flip chip interconnects was investigated to find out an ideal nickel composition. Sn-1.2Ag-0.5Cu-xNi (x: 0.05, 0.10 and 0.20) had longer thermal fatigue life than S
Publikováno v:
Journal of Electronic Materials. 32:1527-1533
The thermal fatigue properties of Sn-xAg-0.5Cu (x=1, 2, 3, and 4 in mass%) flip-chip interconnects were investigated to study the effect of silver content on thermal fatigue endurance. The solder joints with lower silver context (x=1 and 2) had a gre
Publikováno v:
Materials Letters. 61:2093-2095
A kinetic model based on the principle of maximum degradation rate of the total system free energy, MDR law using thermodynamic data, is proposed and successfully applied to the selection of the first intermetallic compound (IMC) phase in Cu/Sn and N
Publikováno v:
Physica C: Superconductivity. 274:17-23
The effect of eddy current dampers on the vibrational properties in superconducting levitation has been investigated using melt-processed YBaCuO bulk superconductors. In vertical vibration, the damping was about 100 times improved by inserting eddy c