Zobrazeno 1 - 5
of 5
pro vyhledávání: '"Masaki Ohyama"'
Autor:
Shuichi Shoji, Yoichi Shinba, Masatsugu Nimura, Toshihisa Nonaka, Masaki Ohyama, Akitsu Shigetou, Jun Mizuno
Publikováno v:
Microelectronics Reliability. 59:134-139
In this paper, we describe hybrid bonding technology of single-micron pitch with planar structure for three-dimensional (3D) interconnection. Conventionally, underfill method utilizing capillary force was used after the bonding of microbump. However,
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fbc46d07a4376a7d9f9527b4788b6d1c
https://doi.org/10.1016/j.microrel.2015.12.033
https://doi.org/10.1016/j.microrel.2015.12.033
Autor:
Masatsugu Nimura, Tamura Mamoru, Jun Mizuno, Shuichi Shoji, Masaki Ohyama, Tomoyuki Enomoto, Akitsu Shigetou
Publikováno v:
2015 IEEE 65th Electronic Components and Technology Conference (ECTC).
This paper describes hybrid bonding technology of Cu/Sn microbumps and adhesive with silica filler for three-dimensional (3D) interconnection of single-micron pitch. We fabricated bonding structure composed of 8-µm pitch Cu/Sn bumps and uncured adhe
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::55d33f6b43a8a29b5efc7d11c86ae877
https://doi.org/10.1109/ectc.2015.7159612
https://doi.org/10.1109/ectc.2015.7159612
Autor:
Masatsugu Nimura, Toshihisa Nonaka, Yoichi Shinba, Shuichi Shoji, Jun Mizuno, Masaki Ohyama, Akitsu Shigetou
Publikováno v:
2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D).
In this study, we developed 8 μm-pitch microbump bonding and encapsulating by hybrid Cu/Sn-adhesive bonding technology. As an adhesive material, we used a non-conductive film (NCF). To realize simultaneous bonding of a metal and an adhesive, planar
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::68f4b46603a565a603965181be0e7743
https://doi.org/10.1109/ltb-3d.2014.6886187
https://doi.org/10.1109/ltb-3d.2014.6886187
Autor:
Masatsugu Nimura, Jun Mizuno, Shuichi Shoji, Toshihisa Nonaka, Masaki Ohyama, Akitsu Shigetou, Yoichi Shinba
Publikováno v:
2014 International Conference on Electronics Packaging (ICEP).
In this study, we developed single-pitch hybrid bonding technology for high density 3D integration. To realize the single-pitch, smaller than 10-µm pitch, hybrid bonding, 8 µm-pitch Cu/Sn microbumps and nonconductive film (NCF) were used. The plana
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::85a679ea885d37c4392bca81ad6b2d40
https://doi.org/10.1109/icep.2014.6826751
https://doi.org/10.1109/icep.2014.6826751
Publikováno v:
Agricultural and Biological Chemistry. 48:2731-2738
Themetabolic fates of the carbonskeletons of L-(U-14C)arginine, proline and glutamic acid were investigated in growing rats fed with diets containing different percentages of protein calories (0, 5, 10, 15 and 30 PC%) at 4100 kcal ofmetabolizable ene
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::392dd8f1b1fdbb27a7e6a8b42d1655e9
https://doi.org/10.1271/bbb1961.48.2731
https://doi.org/10.1271/bbb1961.48.2731