Zobrazeno 1 - 10
of 135
pro vyhledávání: '"Masaki Hashizume"'
Autor:
Masaki Hashizume, Hiroyuki Yotsuyanagi
Publikováno v:
Journal of The Japan Institute of Electronics Packaging. 24:663-667
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2c65292b6288156af15919f2b2b50597
https://doi.org/10.5104/jiep.24.663
https://doi.org/10.5104/jiep.24.663
Autor:
Masaki Hashizume
Publikováno v:
Journal of The Japan Institute of Electronics Packaging. 24:484-487
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d7969ec74d31d525a9d1c97fad906b84
https://doi.org/10.5104/jiep.24.484
https://doi.org/10.5104/jiep.24.484
Autor:
Masao Ohmatsu, Fumiya Sako, Yuki Ikiri, Hiroyuku Yotsuyanagi, Shyue-Kung Lu, Masaki Hashizume
Publikováno v:
2022 IEEE CPMT Symposium Japan (ICSJ).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f45e7bede1f1ca74733458636b935f84
https://doi.org/10.1109/icsj55786.2022.10034736
https://doi.org/10.1109/icsj55786.2022.10034736
Publikováno v:
2022 IEEE 31st Asian Test Symposium (ATS).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7558c245df5cc6dd84fc3e351375745c
https://doi.org/10.1109/ats56056.2022.00015
https://doi.org/10.1109/ats56056.2022.00015
Autor:
Masao Ohmatsu, Yuto Ohtera, Yuki Ikiri, Hiroyuki Yotsuyanagi, Shyue-Kung Lu, Masaki Hashizume
Publikováno v:
2022 IEEE 31st Asian Test Symposium (ATS).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cedec9f3c4ca3312fa9c02ff3ec6b988
https://doi.org/10.1109/ats56056.2022.00021
https://doi.org/10.1109/ats56056.2022.00021
Autor:
Hiroyuki Yotsuyanagi, Yutaka Uematsu, Fumiya Sako, Yasuhiro Ikeda, Masaki Hashizume, Yuki Ikiri, Toru Yazaki, Shyue-Kung Lu
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 11:931-943
In this article, we propose two kinds of electrical interconnect test methods for production tests and field ones of assembled circuit boards, which are performed prior to and after shipping to market, respectively. For these tests, we also propose a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4290041f8eec81e9cda8f0f6c20d3358
https://doi.org/10.1109/tcpmt.2021.3079159
https://doi.org/10.1109/tcpmt.2021.3079159
Autor:
Chi-Tien Sun, Chun-Lung Hsu, Hiroyuki Yotsuyanagi, Masaki Hashizume, Shu-Chi Yu, Shyue-Kung Lu
Publikováno v:
IEEE Transactions on Very Large Scale Integration (VLSI) Systems. 28:634-645
By analyzing the fault behaviors of conventional flash memory fault models, two new concise fault types are proposed: the 1-safe fault and the 0-safe fault. For a 1(0)-safe fault, if logic 1(0) is programmed into the faulty cell, the effect of the fa
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b7525568d33189a53d128e491943d75b
https://doi.org/10.1109/tvlsi.2019.2957830
https://doi.org/10.1109/tvlsi.2019.2957830
Publikováno v:
2021 International Conference on Electronics Packaging (ICEP).
It is discussed in this paper what resistance increase can be detected by an electrical interconnect test method that occurs after shipping to market at interconnects between ICs and printed circuit boards. The test method is based on a quiescent cur
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5407fb8acd48a2bea8d4985188a24bf7
https://doi.org/10.23919/icep51988.2021.9451913
https://doi.org/10.23919/icep51988.2021.9451913
Publikováno v:
Journal of Electronic Testing. 34:559-570
Novel fault leveling techniques based on address remapping (AR) are proposed in this paper. We can change the logical-to-physical address mapping of the page buffer such that faulty cells within a flash page can be evenly distributed into different c
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b839b2e3c6a24e2cf22cb9c2ac52ac90
https://doi.org/10.1007/s10836-018-5752-7
https://doi.org/10.1007/s10836-018-5752-7
Publikováno v:
IEICE Transactions on Information and Systems. :2053-2063
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9e449df70f4bc58849ad7174048a19bd
https://doi.org/10.1587/transinf.2018edp7093
https://doi.org/10.1587/transinf.2018edp7093