Zobrazeno 1 - 9
of 9
pro vyhledávání: '"Masaichi Hashimoto"'
Publikováno v:
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::881060a4060ee890d6b00bc03eb323fc
https://doi.org/10.1109/eptc56328.2022.10013117
https://doi.org/10.1109/eptc56328.2022.10013117
Publikováno v:
2022 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2f9d38f99704a5a4fdc153436a459a9e
https://doi.org/10.1109/ipfa55383.2022.9915729
https://doi.org/10.1109/ipfa55383.2022.9915729
Publikováno v:
2020 IEEE International Symposium on Radio-Frequency Integration Technology (RFIT).
We demonstrate Cherenkov-type phase-matched terahertz wave generation using a LiNbO 3 waveguide that incorporates a half-conic silicon prism, which efficiently generates broadband terahertz waves in a frequency range up to 7 THz with a pulse duration
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ccd467b39c4627e370b9ea1dcf08b2a7
https://doi.org/10.1109/rfit49453.2020.9226170
https://doi.org/10.1109/rfit49453.2020.9226170
Publikováno v:
2020 IEEE International Symposium on Radio-Frequency Integration Technology (RFIT).
This paper presents a terahertz (THz) optical sampling technique and discusses some industrial applications in semiconductor manufacturing and failure analysis. The use of ultrashort pulse fiber lasers and specific electro-optical or opto-electrical
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::205bd4197205aa4f643c7ad76aea6c87
https://doi.org/10.1109/rfit49453.2020.9226197
https://doi.org/10.1109/rfit49453.2020.9226197
Publikováno v:
2017 IEEE 19th Electronics Packaging Technology Conference (EPTC).
2.5D chips with TSV and interposer are becoming the most popular packaging method with great increased flexibility and integrated functionality. However, great challenges have been posed in the failure analysis process to precisely locate the failure
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cb83beedc254759249a8424579c3e3ff
https://doi.org/10.1109/eptc.2017.8277467
https://doi.org/10.1109/eptc.2017.8277467
Autor:
Yasuhide Maehara, Akiyoshi Irisawa, Masaichi Hashimoto, Shigeki Nishina, Takanori Okada, Makoto Shinohara, Motoki Imamura, Tsuyoshi Ataka
Publikováno v:
2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA).
It is getting significant to identify the fault location in advanced IC packaging technology. However, challenges have been posed to precisely determine the fault location in the failure analysis process, which is difficult to be handled by the conve
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::343d5e9b0d9986c75048006c105184d6
https://doi.org/10.1109/ipfa.2016.7564290
https://doi.org/10.1109/ipfa.2016.7564290
Autor:
Tsuyoshi Ataka, T. Okada, Masaichi Hashimoto, Akiyoshi Irisawa, Shigeki Nishina, Motoki Imamura
Publikováno v:
2015 40th International Conference on Infrared, Millimeter, and Terahertz waves (IRMMW-THz).
A time-domain reflectometry (TDR) unit is developed that scans for faults in transmission lines with high spatial resolution by transmitting a terahertz wave pulse down the transmission line and measuring the reflected wave. Photoconductive switches
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::31953b28e08edd8b54b7802daa564767
https://doi.org/10.1109/irmmw-thz.2015.7327931
https://doi.org/10.1109/irmmw-thz.2015.7327931
Publikováno v:
IEEJ Transactions on Fundamentals and Materials. 115:145-150
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4a3439c7fe59885ea3383094d5dfaa33
https://doi.org/10.1541/ieejfms1990.115.3_145
https://doi.org/10.1541/ieejfms1990.115.3_145