Zobrazeno 1 - 10
of 41
pro vyhledávání: '"Masaaki Mochida"'
Publikováno v:
Journal of the Japan Society for Precision Engineering. 83:275-280
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a12eba0d4d6c20992509aacdfe6ac589
https://doi.org/10.2493/jjspe.83.275
https://doi.org/10.2493/jjspe.83.275
Publikováno v:
Journal of the Japan Society for Precision Engineering. 82:82-86
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::48cefa8a1f990533a2153dddd4927ccb
https://doi.org/10.2493/jjspe.82.82
https://doi.org/10.2493/jjspe.82.82
Publikováno v:
Journal of the Japan Society for Precision Engineering. 80:950-955
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::43808ff789b26e0d84b49f1dadb6a493
https://doi.org/10.2493/jjspe.80.950
https://doi.org/10.2493/jjspe.80.950
Publikováno v:
Microelectronic Engineering. 112:278-281
A nondeforming chucking technique for EUV lithography has been developed.Temperature distribution and shear and tension forces during freezing were calculated by FEM.Shear strength of 0.2N per pin and tensile strength of 0.34N per pin, and solidifica
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9500deeab2d88f9e9806f500a4e75847
https://doi.org/10.1016/j.mee.2013.04.008
https://doi.org/10.1016/j.mee.2013.04.008
Publikováno v:
Microelectronic Engineering. 88:2163-2166
A site flatness of less than 26nm will be required when fabricating next-generation devices. A pin chuck is used to flatten warped wafers. This chuck has lift holes for loading and unloading wafers and a ring seal around its periphery. The lift holes
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f8a1a9b2bb448710b896f5fff340b5f5
https://doi.org/10.1016/j.mee.2011.01.010
https://doi.org/10.1016/j.mee.2011.01.010
Publikováno v:
Microelectronic Engineering. 87:1646-1649
A site flatness of less than 32nm will be required when fabricating next-generation devices. To flatten warped wafers, a pin chuck is used. This chuck has lift holes for loading and unloading wafers and a ring seal around its periphery. It is known t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1e6add6802eff9c29c7c60ce0f134c14
https://doi.org/10.1016/j.mee.2009.10.020
https://doi.org/10.1016/j.mee.2009.10.020
Publikováno v:
Journal of the Japan Society for Precision Engineering. 76:438-442
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::980eea5a24250c6c23ec1977709533f2
https://doi.org/10.2493/jjspe.76.438
https://doi.org/10.2493/jjspe.76.438
Publikováno v:
Journal of the Japan Society for Precision Engineering. 76:1146-1150
CMP is the standard planarization method for silicon wafers. For environment reasons, semiconductor manufacturers have to reduce the consumption of materials, such as slurry. The oscillation-speed-control-type polishing machine uses a small tool and
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2597f8535e797eec97089a6266f7916a
https://doi.org/10.2493/jjspe.76.1146
https://doi.org/10.2493/jjspe.76.1146
Publikováno v:
Journal of the Japan Society for Precision Engineering. 76:299-303
The simulation of lapping to correct the surface profile of a workpiece has been made very little study. In contrast, the simulation of polishing has been developed using the gap theory and it has been demonstrated that there is good agreement betwee
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d77e1d9cd20dcffa55529406ab0a628f
https://doi.org/10.2493/jjspe.76.299
https://doi.org/10.2493/jjspe.76.299
Publikováno v:
Advanced Materials Research. :313-318
The size of the photo mask and mother glass used in liquid crystal display production has increased yearly. Large rectangular glass plates are difficult to planarize using rotary-type polishing machines. We have developed a rotary-type polishing mach
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f9837e40fc65cdf809f375897e0ae8bb
https://doi.org/10.4028/www.scientific.net/amr.76-78.313
https://doi.org/10.4028/www.scientific.net/amr.76-78.313