Zobrazeno 1 - 10
of 95
pro vyhledávání: '"Masaaki KOGANEMARU"'
Publikováno v:
Nihon Kikai Gakkai ronbunshu, Vol 87, Iss 900, Pp 21-00112-21-00112 (2021)
In the manufacture of electronic devices and MEMS, a wide variety of materials are jointed. For light-weight automobiles, CFRP materials are jointed with metallic materials. In these products, jointed interfacial corners are singular stress points, a
Externí odkaz:
https://doaj.org/article/b24ae6b0f90a4ff68007a7076386f937
Publikováno v:
Nihon Kikai Gakkai ronbunshu, Vol 87, Iss 899, Pp 21-00119-21-00119 (2021)
The stress intensity factors (SIFs) for an interfacial corner, which are compatible with that for a crack, can describe the singular stress field around the corner. However, due to the difference of the singular order with the angle of a corner and t
Externí odkaz:
https://doaj.org/article/8546315d973248b088db226b4c38cc7c
Publikováno v:
Nihon Kikai Gakkai ronbunshu, Vol 83, Iss 845, Pp 16-00382-16-00382 (2016)
We proposed a new technique to analyze the asymptotic solution around a three dimensional interface corners. We analyzed the scalar parameters of the asymptotic solutions using the H-integral, which is a conservative integral, in conjunction with the
Externí odkaz:
https://doaj.org/article/4144e619eded48e2954e8fffc125f0eb
Publikováno v:
2023 International Conference on Electronics Packaging (ICEP).
Autor:
Masaaki Koganemaru, Nobuyuki Shishido, Tomoki Sakaguchi, Masaya Kato, Toru Ikeda, Yutaka Hayama, Seiya Hagihara, Noriyuki Miyazaki
Publikováno v:
Journal of The Japan Institute of Electronics Packaging. 25:260-268
Publikováno v:
Journal of The Japan Institute of Electronics Packaging. 25:103-110
Autor:
Seiya Hagihara, Yutaka Hayama, Masaaki Koganemaru, Noriyuki Miyazaki, Tomoki Sakaguchi, Nobuyuki Shishido
Publikováno v:
Journal of The Japan Institute of Electronics Packaging. 24:560-571
Autor:
Nobuyuki Shishido, Shoji Kamiya, Tomohito Sekine, Shizuo Tokito, Toru Ikeda, Masaaki Koganemaru, Koji Hidaka, Takeo Minari
Publikováno v:
Journal of The Japan Institute of Electronics Packaging. 24:586-594
Publikováno v:
Journal of the Society of Materials Science, Japan. 70:412-419
Publikováno v:
Transactions of the JSME (in Japanese). 87:21-00119