Zobrazeno 1 - 7
of 7
pro vyhledávání: '"Masaaki Harazono"'
Autor:
Kenji Terada, Masaaki Harazono
Publikováno v:
Journal of the Surface Finishing Society of Japan. 66:38-42
Autor:
Masahiro Fukui, Charles F. Carey, Teruya Fujisaki, Hilton T. Toy, Kenji Terada, Masaaki Harazono, Sushumna Iruvanti, Tomoyuki Yamada, Brian R. Sundlof, Yi Pan, Kamal K. Sikka, Charlie Reynolds, Rebecca N. Wagner
Publikováno v:
International Symposium on Microelectronics. 2014:000068-000073
In organic packages, large die and large laminate body sizes are susceptible to CTE (coefficient of thermal expansion) mismatch driven warpage, stresses and strains, which can result in C4 white bumps, micro Ball Grid Array (BGA) interconnection issu
Autor:
Hsichang Liu, Scott Alan Moore, Masahiro Fukui, Kenji Terada, Brian R. Sundlof, Masaaki Harazono, Tomoyuki Yamada, Teruya Fujisaki, Hongqing Zhang, Sushumna Iruvanti, Jean Audet, Charles L. Reynolds, Yi Pan
Publikováno v:
International Symposium on Microelectronics. 2013:000538-000545
This paper describes a Chip Scale Package (CSP) development project and evaluation of the corresponding organic laminate material. Chip scale packaging can combine the strengths of various packaging technologies, such as the large size and performanc
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 1:647-652
A key to a high-wiring-density build-up substrate is fine circuitry formation technology to satisfy the ever-increasing demands for miniaturization of electronics products. The surface roughness of a dielectric layer needs to be in the submicrometer
Autor:
Kenji Terada, Sushumna Iruvanti, Masahiro Fukui, Hsichang Liu, Hongqing Zhang, Masaaki Harazono, Scott Alan Moore, Jean Audet, Tomoyuki Yamada, Charles L. Reynolds, Yi Pan
Publikováno v:
2013 IEEE 63rd Electronic Components and Technology Conference.
This paper describes the development of a low CTE organic Chip Scale Package (CSP) jointly by KST and IBM. Tests carried out on the low CTE laminate material and subsequently on the related CSP are described. The new material set, identified as Advan
Publikováno v:
BUNSEKI KAGAKU. 29:601-606
Conference
Tento výsledek nelze pro nepřihlášené uživatele zobrazit.
K zobrazení výsledku je třeba se přihlásit.
K zobrazení výsledku je třeba se přihlásit.