Zobrazeno 1 - 10
of 13
pro vyhledávání: '"Maryam Mesgarpour Tousi"'
Autor:
Maryam Mesgarpour Tousi, Mona Ghassemi
Publikováno v:
Energies, Vol 13, Iss 8, p 2022 (2020)
Our previous studies showed that geometrical techniques including (1) metal layer offset, (2) stacked substrate design and (3) protruding substrate, either individually or combined, cannot solve high electric field issues in high voltage high-density
Externí odkaz:
https://doaj.org/article/d10f8a77bc6a46a0b03805d03fb978e7
Autor:
Mona Ghassemi, Maryam Mesgarpour Tousi
Publikováno v:
IEEE Journal of Emerging and Selected Topics in Power Electronics. 8:343-350
In addition to higher blocking voltages of wide bandgap (WBG) power modules, their volume has been targeted to be several times smaller than that of Si-based modules. This translates into higher electric stress within the module and, in turn, a highe
Autor:
Mona Ghassemi, Maryam Mesgarpour Tousi
Publikováno v:
IEEE Transactions on Dielectrics and Electrical Insulation. 27:305-313
Wide bandgap (WBG) power modules made from materials such as SiC and GaN (and soon Ga 2 O 3 and diamond), which can tolerate higher voltages and currents than Si-based modules, are the most promising solution for reducing the size and weight of power
Autor:
Mona Ghassemi, Maryam Mesgarpour Tousi
Publikováno v:
2020 IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP).
Wide-bandgap (WBG) power devices can tolerate higher currents and voltages than their silicon (Si)-based counterparts. However, the realization of their superior characteristics is tied to the reliability of their packaging, where thermal management
Autor:
Maryam Mesgarpour Tousi, Mona Ghassemi
As shown in our previous studies, geometrical field grading techniques such as stacked and protruding substrate designs cannot well mitigate high electric stress issue within power electronics modules. However, it was shown that a combination of prot
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::16a11dee4c104bc15ed84a7a98e6e67c
http://arxiv.org/abs/2006.14657
http://arxiv.org/abs/2006.14657
Autor:
Mona Ghassemi, Maryam Mesgarpour Tousi
Publikováno v:
Energies; Volume 13; Issue 8; Pages: 2022
Energies, Vol 13, Iss 2022, p 2022 (2020)
Energies, Vol 13, Iss 2022, p 2022 (2020)
Our previous studies showed that geometrical techniques including (1) metal layer offset, (2) stacked substrate design and (3) protruding substrate, either individually or combined, cannot solve high electric field issues in high voltage high-density
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::38fc942e513ca4d15a323e4b87ad016d
https://hdl.handle.net/10919/97927
https://hdl.handle.net/10919/97927
Autor:
Yoel Fink, Anbo Wang, Li Yu, Chong Hou, Shaowei Wan, Yujing Zhang, Maryam Mesgarpour Tousi, Ning Yan, Xiaoting Jia
Publikováno v:
Polymers
Volume 11
Issue 12
Volume 11
Issue 12
In this study, we fabricated a highly flexible fiber-based capacitive humidity sensor using a scalable convergence fiber drawing approach. The sensor&rsquo
s sensing layer is made of porous polyetherimide (PEI) with its porosity produced in situ
s sensing layer is made of porous polyetherimide (PEI) with its porosity produced in situ
Autor:
Mona Ghassemi, Maryam Mesgarpour Tousi
Publikováno v:
2019 IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP).
In this paper, it is shown that nonlinear field-dependent conductivity (FDC) material as a coating layer applied to the high electric field regions in combination with two geometrical techniques known as 1) stacked substrate, and 2) protruding substr
Autor:
Maryam Mesgarpour Tousi, Mona Ghassemi
Publikováno v:
2019 IEEE Energy Conversion Congress and Exposition (ECCE).
Wide bandgap (WBG) power modules made from materials such as SiC and GaN (and soon Ga2O3 and diamond) able to tolerate higher voltages and currents than Si-based modules are the most promising solution to reducing the size and weight of power electro
Autor:
Maryam Mesgarpour Tousi, Mona Ghassemi
Publikováno v:
2019 IEEE Energy Conversion Congress and Exposition (ECCE).
In this paper, we introduce a new substrate design "protruding stacked substrate" that in combination with applying nonlinear field dependent conductivity (FDC) materials to high electric stress regions can thoroughly address the electrical field enh