Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Maruko Wu"'
Publikováno v:
IMAPSource Proceedings. 2022
In the advanced packaging industry, both fan-out wafer-level packaging (FOWLP) and fan-out panel-level packaging (FOPLP) have grown quickly in recent years since they are compatible with largescale, low-cost manufacturing and are key enablers for ult
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3b29fe728691259acd9312b263ab9c34
https://doi.org/10.4071/001c.74601
https://doi.org/10.4071/001c.74601
Autor:
Xavier Colonna de Lega, Martin Fay, Ryan Kruse, David Grigg, Michael Darwin, Matthew Knowles, John Barnak, Maruko Wu, Erik M. Secula, David G. Seiler, Rajinder P. Khosla, Dan Herr, C. Michael Garner, Robert McDonald, Alain C. Diebold
Publikováno v:
AIP Conference Proceedings.
Interference microscopy satisfies many of the dimensional metrology requirements for semiconductor device interconnects manufacturing by providing 3D topography maps of patterned structures with sub‐nm vertical reproducibility. Analysis of topograp
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ac28b6a4d1785fd256171adc78f35c74
https://doi.org/10.1063/1.3251251
https://doi.org/10.1063/1.3251251
Autor:
de Lega, Xavier Colonna, Fay, Martin, Kruse, Ryan, Grigg, David, Darwin, Michael, Knowles, Matthew, Barnak, John, Maruko Wu
Publikováno v:
AIP Conference Proceedings; 9/28/2009, Vol. 1173 Issue 1, p359-363, 5p, 1 Black and White Photograph, 4 Diagrams, 3 Charts, 2 Graphs