Zobrazeno 1 - 10
of 165
pro vyhledávání: '"Martin-Schneider Ramelow"'
Publikováno v:
Textiles, Vol 3, Iss 1, Pp 66-87 (2023)
For textile-based electronic systems with multiple contacts distributed over a large area, it is very complex to create reliable electrical and mechanical interconnections. In this work, we report for the first time on the use of rotating ultrasonic
Externí odkaz:
https://doaj.org/article/5a01f06b5640473095f6752ea8a5f550
Autor:
Maria Lykova, Iuliana Panchenko, Martin Schneider-Ramelow, Tadatomo Suga, Fengwen Mu, Roy Buschbeck
Publikováno v:
Micromachines, Vol 14, Iss 7, p 1365 (2023)
Cu-Cu direct interconnects are highly desirable for the microelectronic industry as they allow for significant reductions in the size and spacing of microcontacts. The main challenge associated with using Cu is its tendency to rapidly oxidize in air.
Externí odkaz:
https://doaj.org/article/1003d249e5914bbe8877ab2a21af7e00
Publikováno v:
Micromachines, Vol 12, Iss 11, p 1429 (2021)
Safety is a crucial issue in hydrogen energy applications due to the unique properties of hydrogen. Accordingly, a suitable hydrogen sensor for leakage detection must have at least high sensitivity and selectivity, rapid response/recovery, low power
Externí odkaz:
https://doaj.org/article/4dc405d84f9541b9970d87e11cd45acc
Autor:
Buschbeck, Maria Lykova, Iuliana Panchenko, Martin Schneider-Ramelow, Tadatomo Suga, Fengwen Mu, Roy
Publikováno v:
Micromachines; Volume 14; Issue 7; Pages: 1365
Cu-Cu direct interconnects are highly desirable for the microelectronic industry as they allow for significant reductions in the size and spacing of microcontacts. The main challenge associated with using Cu is its tendency to rapidly oxidize in air.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=multidiscipl::419e9b578a1d0990b693d357565c9e8f
Publikováno v:
Solid State Phenomena. 333:3-10
Most e-textiles are developed for wearable use and thus need to be washable to guarantee a textile typical usability. Yet, there are no e-textile specific wash testing standards and as a result, employed testing protocols vary greatly, resulting in a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ca08e5d1d0674de362e4b4a29f62abad
https://doi.org/10.4028/p-c73oww
https://doi.org/10.4028/p-c73oww
Publikováno v:
2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d75468f597cf8b3d915b87b92019d4ea
https://doi.org/10.1109/eurosime56861.2023.10100794
https://doi.org/10.1109/eurosime56861.2023.10100794
Autor:
Andreas Stegmaier, Ole Hölck, Marius van Dijk, Hans Walter, Olaf Wittler, Martin Schneider-Ramelow
Publikováno v:
2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::73b86c139146a6280726164909c91dc7
https://doi.org/10.1109/eurosime56861.2023.10100849
https://doi.org/10.1109/eurosime56861.2023.10100849
Publikováno v:
2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1eae81e4f7ea6838b8e4790faf58057e
https://doi.org/10.1109/eurosime56861.2023.10100845
https://doi.org/10.1109/eurosime56861.2023.10100845
Autor:
Vanessa Zamora, Paul Preussler, Jonas Herter, Sebastian Marx, Henning Schroeder, Martin Schneider-Ramelow
Publikováno v:
Frontiers in Biological Detection: From Nanosensors to Systems XV.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c4822aa8eae086a189545ee970e6548a
https://doi.org/10.1117/12.2650422
https://doi.org/10.1117/12.2650422
Autor:
Tanja Braun, Ole Hölck, Marcus Voitel, Mattis Obst, Steve Voges, Karl-Friedrich Becker, Rolf Aschenbrenner, Martin Schneider-Ramelow
Publikováno v:
2023 7th IEEE Electron Devices Technology & Manufacturing Conference (EDTM).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9044fe94b97659d42ff8fb6659e49d2d
https://doi.org/10.1109/edtm55494.2023.10102969
https://doi.org/10.1109/edtm55494.2023.10102969