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Publikováno v:
2019 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP).
With the fast and continuous evolution of MEMS devices, scientists and engineers facing different challenges each day. They overcome these challenges, with new materials, new fabrication methods, and different physical concepts. Using new materials a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0b001a7ec72b0c48fa7f5d3c75773c12
https://doi.org/10.1109/dtip.2019.8752638
https://doi.org/10.1109/dtip.2019.8752638
