Zobrazeno 1 - 10
of 10
pro vyhledávání: '"Martin Sobczak and"'
Autor:
Garian Lim, Pritha Choudhury, Siuli Sarkar, Prathap Augustine, Anil Kumar, Raghu R. Rangaraju, Rommel T. Bumagat, Divya Kosuri, Martin Sobczak, Suresh Telu, Morgana de Avila Ribas, Bawa Singh
Publikováno v:
2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC).
Wafer-Level Chip-Scale Packaging (WLCSP) has become increasingly popular in portable electronics. One of its main characteristics is its reduced scale and that the solder balls are attached directly to the device. One of the main challenges in WLCSP
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8e6cbf76b61601d8e585822cca79b9cb
https://doi.org/10.1109/eptc.2015.7412266
https://doi.org/10.1109/eptc.2015.7412266
Autor:
Peter J. Wagner, Martin Sobczak
Publikováno v:
Tetrahedron Letters. 39:2523-2526
UV irradiation of the title compound produces cis-1,2-diphenylbenzocyclobutenol quantitatively. While stable at temperatures below 0°, at room temperature it establishes a high enough equilibrium population of its EE o-xylylenol precursor to undergo
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c023ba406429363f4c3b8bb21df4f98c
https://doi.org/10.1016/s0040-4039(98)00405-5
https://doi.org/10.1016/s0040-4039(98)00405-5
Publikováno v:
Journal of the American Chemical Society. 117:7619-7629
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::57424b8150d1d9c80e78000daed6426e
https://doi.org/10.1021/ja00134a006
https://doi.org/10.1021/ja00134a006
Autor:
Ritwik Chatterjee, Scott K. Pozder, Hannes Kostner, Ankur Jain, Eddie Acosta, Martin Sobczak, Senthil Kanagavel, Gerhard Hillmann, Bill Marlin, Gerald Kreindl, Stefan Pargfrieder, Robert E. Jones, Zhihong Huang
Publikováno v:
2008 International Interconnect Technology Conference.
The simultaneous formation of Cu/Sn microconnects and an adhesive bond during wafer level thermal compression bonding was evaluated using a 3D enabled single metal level test die and wafer. The wafer level bond process relied on locally dispensed adh
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2664db3b43b1b6bbf2937f0ba139e584
https://doi.org/10.1109/iitc.2008.4546921
https://doi.org/10.1109/iitc.2008.4546921
Autor:
Peter J. Wagner, Martin Sobczak and
Publikováno v:
Organic letters. 4(3)
Near-UV irradiation of both o-acetylphenyl- and o-benzoylphenylacetic acids in benzene solution results in their efficient decarboxylation. Their meta and para isomers do not undergo this process. The O-deuterated acids yield deuterated o-acyltoluene
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::1a06a1487171bfa284846c35af91ecb7
https://pubmed.ncbi.nlm.nih.gov/11820884
https://pubmed.ncbi.nlm.nih.gov/11820884
Publikováno v:
Journal of the American Chemical Society. 120:2488-2489
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2f2eae35c69c1ed0586a1eb3961275fc
https://doi.org/10.1021/ja9736976
https://doi.org/10.1021/ja9736976
Autor:
Ribas, Morgana, Lim, Garian, Bumagat, Rommel T., Kumar, Anil, Kosuri, Divya, Augustine, Prathap, Choudhury, Pritha, Rangaraju, Raghu R., Telu, Suresh, Sarkar, Siuli, Sobczak, Martin, Singh, Bawa
Publikováno v:
2015 IEEE 17th Electronics Packaging & Technology Conference (EPTC); 1/1/2015, p1-6, 6p
Publikováno v:
2001 Proceedings 51st Electronic Components & Technology Conference (Cat. No.01CH37220); 2001, p564-570, 7p
Autor:
Takano, T., Renyi Wang, Kuder, R., Lam, S., Kuriyama, K., Seki, K., Yoshie, T., Sakai, A., Emmerson, G.T., Seeley, G.J.
Publikováno v:
2004 Proceedings 54th Electronic Components & Technology Conference (IEEE Cat. No.04CH37546); 2004, p1354-1354, 1p
Autor:
Peter Navarro
Most companies ignore one of their best opportunities for honing competitive advantage: the opportunity to proactively manage business cycles and macroeconomic turbulence. Despite the profound impact that the business cycle has on the fortunes and fa
