Zobrazeno 1 - 10
of 28
pro vyhledávání: '"Martin Sczyrba"'
Publikováno v:
Photomask Technology 2019.
With semiconductor technology approaching and exceeding 10 nm design rules the quality requirements for photomasks are continuously tightening. One of the crucial parameters is improved control of the critical dimension (CD) across the photomask. As
Publikováno v:
35th European Mask and Lithography Conference (EMLC 2019).
The currently increasing demand for photo-masks in the regime of the 14nm technology drives many initiatives towards capacity and throughput increase of existing production line. Such improvements are facilitated by improved control mechanisms of the
Publikováno v:
Photomask Japan 2019: XXVI Symposium on Photomask and Next-Generation Lithography Mask Technology.
The currently increasing demand for photo-masks in the regime of the 14nm technology drives many initiatives towards capacity and throughput increase of existing production lines. Such improvements are facilitated by improved control mechanisms of th
Autor:
Aravind Narayana Samy, Bernd Geh, Alla Bitensky, Marija Djordjevic Kaufmann, Thomas Thamm, Martin Sczyrba, Rolf Seltmann
Publikováno v:
Optical Microlithography XXXI.
Within the current paper, we will concentrate on the well-known CDC technique from Carl Zeiss to improve the CD distribution of the wafer by improving the reticle CDU and its impact on hotspots and Litho process window. The CDC technique uses an ultr
Publikováno v:
Shanker, A; Sczyrba, M; Connolly, B; Waller, L; & Neureuther, A. (2015). Absorber topography dependence of phase edge effects. Proceedings of SPIE-The International Society for Optical Engineering, 9635. doi: 10.1117/12.2197861. UC Berkeley: Retrieved from: http://www.escholarship.org/uc/item/9789n99x
© 2015 SPIE. Mask topography contributes to phase at the wafer plane, even for OMOG binary masks currently in use at the 22nm node in deep UV (193nm) lithography. Here, numerical experiments with rigorous FDTD simulation are used to study the impact
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::1f18422c2a87a4dbe7cbbf0be7f6bc26
https://escholarship.org/uc/item/9789n99x
https://escholarship.org/uc/item/9789n99x
Publikováno v:
Imaging and Applied Optics 2015.
The Transport of Intensity Equation solves for optical phase from through-focus intensity when the in-plane power flow is curl-free, giving artifacts in presence of curl. An iterative solver is shown to correct artifacts and recover power flow curl.
Publikováno v:
Shanker, A; Tian, L; Sczyrba, M; Connolly, B; Neureuther, A; & Waller, L. (2014). Transport of intensity phase imaging in the presence of curl effects induced by strongly absorbing photomasks. Applied Optics, 53(34), J1-J6. doi: 10.1364/AO.53.0000J1. UC Berkeley: Retrieved from: http://www.escholarship.org/uc/item/3d33s5b8
Applied optics, vol 53, iss 34
Applied optics, vol 53, iss 34
© 2014 Optical Society of America. We report theoretical and experimental results for imaging of electromagnetic phase edge effects in lithography photomasks. Our method starts from the transport of intensity equation (TIE), which solves for phase f
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::170bad8d21a5d21d4470b38b2499e4cf
http://www.escholarship.org/uc/item/3d33s5b8
http://www.escholarship.org/uc/item/3d33s5b8
Autor:
Martin Sczyrba, Aamod Shanker, Laura Waller, Franklin Kalk, Andrew R. Neureuther, Brid Connolly
Publikováno v:
SPIE Proceedings.
Photomasks are expected to have phase effects near edges due to their 3D topography, which can be modeled as imaginary boundary layers in thin mask simulations. We apply a modified transport of intensity (TIE) phase imaging technique to through-focus
Publikováno v:
SPIE Proceedings.
Thick mask electromagnetic edge effects in attenuating phase-shift masks (ATT-PSM) are analyzed by extracting optical phase at the wafer plane from a series of through focus aerial images with 193nm light. The thick edges of an ATT-PSM can lead to ph
Autor:
Harry J. Levinson, Frank Schurack, Jongwook Kye, Fan Jiang, Yunfei Deng, Byoung Il Choi, Martin Sczyrba, Paul Ackmann
Publikováno v:
SPIE Proceedings.
For 20 nm technology, rigorous electromagnetic field (EMF) simulation is important to predict correct lithography performance in mask development. Three mask absorbers with different total thickness and materials are used in the paper to explore the