Zobrazeno 1 - 2
of 2
pro vyhledávání: '"Martin Plaček"'
Publikováno v:
Metals, Vol 12, Iss 1, p 121 (2022)
Sn–Bi alloys are desirable candidates for soldering components on printed circuit boards (PCBs) because of their low melting point and reduced cost. While certain tin–bismuth solders are well characterized many new alloys in this family have been
Externí odkaz:
https://doaj.org/article/df3e82efe9c94800b19ecd44db1faa77
Autor:
Ioannis Stamatopoulos, Martin Plaček, Panayotis Kyritsis, Jan Svoboda, Jiří Vohlídal, Vassilis Psycharis, Aris Terzis
Publikováno v:
Inorganica Chimica Acta. 387:390-395
The [Ni{(Ph2P)2N-S-CHMePh-P,P′}Br2] complex was prepared by a ligand-exchange reaction between [Ni(dme)Br2] (dme is 1,2-dimethoxyethane) and the P–N–P ligand (Ph2P)2N(S-CHMePh). X-ray crystallography revealed a square planar NiP2Br2 coordinatio
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ad02c292c2fec0f45e0fc69a2fbff65b
https://doi.org/10.1016/j.ica.2012.02.033
https://doi.org/10.1016/j.ica.2012.02.033