Zobrazeno 1 - 10
of 15
pro vyhledávání: '"Martin Kozak"'
Publikováno v:
Welding in the World. 67:1347-1355
Voids inside solder joints are empty spaces negatively affecting the mechanical, thermal, and electrical properties of the solder joint. This article deals with this problematics using two novel approaches to reduce voids’ occurrence. The first app
Autor:
Karel Dusek, Petr Vesely, Denis Fros, Martin Kozak, Kristina Sorokina, Zbynek Plachy, David Busek, Jaroslav Dusek, Iva Kralova, Marketa Klimtova, Martin Placek
Publikováno v:
2022 45th International Spring Seminar on Electronics Technology (ISSE).
Publikováno v:
Communications Physics, Vol 7, Iss 1, Pp 1-7 (2024)
Abstract Nonlinear optical response of solid-state materials exposed to strong non-resonant light fields leads to the generation of harmonic frequencies as a consequence of interband polarization and coherent intraband dynamics of the electrons. The
Externí odkaz:
https://doaj.org/article/d409ad59514b49af820c11e107ece127
Autor:
Pavel Durst, Jaroslav Dušek, Karel Dusek, Denis Fros, David Busek, Martin Kozak, Petr Vesely, Kristina Sorokina
Publikováno v:
2021 44th International Spring Seminar on Electronics Technology (ISSE).
Electrochemical migration is one of the issues that appears due to specific conditions when the electrolytic solution is present between two neighbouring conductors with different electrical potentials. This article deals with a student’s workplace
Autor:
Karel Dusek, Martin Kozak
Publikováno v:
2021 44th International Spring Seminar on Electronics Technology (ISSE).
One of the hardly predictable issues in the case of solder joints are tin whiskers. Tin whiskers are electrically conductive crystals that spontaneously grow on a surface. This article deals with tin whiskers growth on the three types of metallizatio
Autor:
Martin Kozak, Petr Vesely
Publikováno v:
2020 43rd International Spring Seminar on Electronics Technology (ISSE).
This work aimed to evaluate a change of properties of Bi58Sn42 solder joints on different substrates during accelerated aging tests. Three different surface finishes of the copper soldering pads were chosen - Hot Air Solder Leveling (HASL), Galvanic
Autor:
Martin Kozak, Petr Vesely
Publikováno v:
2020 43rd International Spring Seminar on Electronics Technology (ISSE).
Voids inside solder joints are empty spaces which can cause reliability issues. Solder joints with voids are weaker from a mechanical point of view. Additionally, the soled joints with voids are worse from the point of thermal and electrical properti
Autor:
Artur O. Slobodeniuk, Petr Koutenský, Miroslav Bartoš, František Trojánek, Petr Malý, Tomáš Novotný, Martin Kozák
Publikováno v:
npj 2D Materials and Applications, Vol 7, Iss 1, Pp 1-7 (2023)
Abstract Increasing the speed limits of conventional electronics requires innovative approaches to manipulate other quantum properties of electrons besides their charge. An alternative approach utilizes the valley degree of freedom in low-dimensional
Externí odkaz:
https://doaj.org/article/1ca45b0aece84fe5af7e102fba3e016f
Autor:
Martin Kozak, Martin Placek, Karel Dusek, Ivana Beshajova Pelikanova, Martin Molhanec, David Busek, Adam Petrac
Publikováno v:
2017 40th International Spring Seminar on Electronics Technology (ISSE).
Mechanical stress act on solder joints during transport, function and storage of the electronic equipment. Therefore, the knowledge of solder joints resistance against it is very useful. This article deals with comparison of mechanical resistance of
Publikováno v:
Communications Physics, Vol 5, Iss 1, Pp 1-8 (2022)
High harmonic generation in solids has been intensively studied for compact extreme ultraviolet light sources and for understanding of the inner workings of solids. In this study, the authors conducted polarization-resolved nonlinear spectroscopy of
Externí odkaz:
https://doaj.org/article/a4121e6be64b4f4fb042144cdfd2aa5f