Zobrazeno 1 - 10
of 29
pro vyhledávání: '"Martin Ihle"'
Autor:
Romain Trihan, Oskar Bogucki, Anna Kozlowska, Martin Ihle, Steffen Ziesche, Bartosz Fetliński, Bartosz Janaszek, Marcin Kieliszczyk, Marcin Kaczkan, Fabrice Rossignol, Anne Aimable
Publikováno v:
Heliyon, Vol 9, Iss 5, Pp e15977- (2023)
The current work focuses on the synthesis of hybrid nanoparticles (NPs) made of a silica core (Si NPs) coated with discrete gold nanoparticles (Au NPs), which exhibit localized surface plasmon resonance (LSPR) properties. This plasmonic effect is dir
Externí odkaz:
https://doaj.org/article/443bd0eb58634e13a6b2d2ad652c56bd
Autor:
Norbert Kordas, Alexander Utz, Andre Kosfeld, Olaf Rämer, Sebastian Braun, Steffen Ziesche, Martin Ihle, Rainer Kokozinski, Constanze Weber, Malte Spanier, Holger Kappert
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2021:000018-000024
Sensors are key elements for capturing environmental properties and are increasingly important in the industry for the intelligent control of industrial processes. While in many everyday objects highly integrated sensor systems are already state of t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::3bea85fec90a497dec4b267abb08122f
https://doi.org/10.4071/2380-4491.2021.hitec.000018
https://doi.org/10.4071/2380-4491.2021.hitec.000018
Publikováno v:
Advances in Manufacturing, Production Management and Process Control ISBN: 9783030519803
AHFE (16)
AHFE (16)
The migration of Manufacturing Execution Systems could eliminate existing paper-based communication media for engineers and operators. This paper presents an approach to solve the resulting information deficit for the R&D process by the integration o
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ef72646c707144f607656c3050b2a3f3
https://doi.org/10.1007/978-3-030-51981-0_31
https://doi.org/10.1007/978-3-030-51981-0_31
Publikováno v:
Microelectronics International. 35:164-171
Purpose The purpose of this paper is to analyze a presentation of eddy current sensing coils for the turbo charger speed measurement, which were manufactured with the low temperature co-fired ceramic (LTCC) technology. The goal is to be able to manuf
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::fc0d69814de0f6d49b5c71fd3af58fd7
https://doi.org/10.1108/mi-12-2017-0067
https://doi.org/10.1108/mi-12-2017-0067
Autor:
Richard Marsden, Hans-Martin Ihle
Publikováno v:
Telecommunications Policy. 42:315-322
A key concern with the Licensed-shared access (LSA) approach currently being developed by European regulators is that leaving incumbents and secondary users to agree to bilateral arrangements may be insufficient to incentivise an optimal level of sha
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a8335cb6a67f3b71d42c7a945ffda47a
https://doi.org/10.1016/j.telpol.2017.07.001
https://doi.org/10.1016/j.telpol.2017.07.001
Publikováno v:
2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC).
In this paper, the authors presents about an Aerosol Jet printed interconnect technology between a GaAs MMIC and an LTCC packaging. Conductive silver nanoparticle and a dielectric polymer-based glob-top are utilized to fabricate die attach, dielectri
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8b6e636eaa52f5f9d5865696bb19776d
https://doi.org/10.23919/empc44848.2019.8951799
https://doi.org/10.23919/empc44848.2019.8951799
Publikováno v:
2018 7th Electronic System-Integration Technology Conference (ESTC).
Low Temperature Co-fired Ceramics (LTCC) is a ceramic multilayer material with properties that suit well as both as a substrate and packaging material. LTCCs multilayer capabilities, excellent electrical properties, extremely high reliability and ful
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ba1272a5e57d69d0b3de5a8060b537d0
https://doi.org/10.1109/estc.2018.8546400
https://doi.org/10.1109/estc.2018.8546400
Publikováno v:
Scopus-Elsevier
Aerosol jet printing is a rather new technology for the deposition of thick film structures offering high line and space resolution. This offers a high potential for miniaturization for thick film structures. The advantages of this technology could b
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::b9b14bdcec1161c8df90fcae9a27c4b3
https://doi.org/10.4071/imaps.384
https://doi.org/10.4071/imaps.384
Autor:
Manuel Bauscher, Martin Ihle, Piotr Mackowiak, Ha-Duong Ngo, Klaus-Dieter Lang, Ulli Hansen, Biswajit Mukhopadhyay, Xiaodong Hu, Steffen Ziesche, Yucheng Zhang, Oliver Gyenge, Hans Walter, Simon Maus, Oswin Ehrmann, Ole Hoelck
Publikováno v:
2016 IEEE 18th Electronics Packaging Technology Conference (EPTC).
This work helps to clarify the effects on bondable Low Temperature Cofiered Cofired Ceramic(LTCC) material from Fraunhofer IKTS under different bonding conditions as changes in temperature, voltage and time. The Paper investigates silicon bonded to L
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c284233c91d067f7e04d480ac600a83d
https://doi.org/10.1109/eptc.2016.7861529
https://doi.org/10.1109/eptc.2016.7861529
Publikováno v:
2016 39th International Spring Seminar on Electronics Technology (ISSE).
The contribution deals with a new wafer level based packaging technology for MEMS. Wafer level packages have advantages compared to standard packaging technologies (miniaturization, cost reduction due to work in multiple panels, optimization of funct
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e28e7e85d17c55c2eff9bdf2a21454dc
https://doi.org/10.1109/isse.2016.7563177
https://doi.org/10.1109/isse.2016.7563177