Zobrazeno 1 - 9
of 9
pro vyhledávání: '"Martin Fleischman"'
Publikováno v:
Journal of Spatial Information Science, Iss 28, Pp 75-102 (2024)
Street networks are ubiquitous components of cities, guiding their development and enabling movement from place to place; street networks are also the critical components of many urban analytical methods. However, their graph representation is often
Externí odkaz:
https://doaj.org/article/626229151e804315aafcb1338f829b44
Autor:
Bongtae Han, Adwait Inamdar, Alexandru Prisacaru, Martin Fleischman, Agnes Veres, Yu-Hsiang Yang, Erick Franieck, Csaba Nemeth, Przemyslaw Jakub Gromala
Publikováno v:
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
In the automotive industry, epoxy-based molding compounds (EMCs) are often used to protect not only single IC packages but also entire electronic control units (ECUs). The EMC undergoes thermal aging during the operation-lifecycle of its parent elect
Autor:
Martin Fleischmann, Daniel Arribas-Bel
Publikováno v:
Scientific Data, Vol 9, Iss 1, Pp 1-15 (2022)
Abstract The spatial arrangement of the building blocks that make up cities matters to understand the rules directing their dynamics. Our study outlines the development of the national open-source classification of space according to its form and fun
Externí odkaz:
https://doaj.org/article/f7604a0059b145e989b9d37cae2b8e56
Autor:
Martin Fleischmann, Daniel Arribas-Bel
Publikováno v:
Scientific Data, Vol 10, Iss 1, Pp 1-1 (2023)
Externí odkaz:
https://doaj.org/article/a04f3e47ad4d48988b5d19c58f5174c7
Autor:
Krasen Samardzhiev, Martin Fleischmann, Daniel Arribas-Bel, Alessia Calafiore, Francisco Rowe
Publikováno v:
Data in Brief, Vol 43, Iss , Pp 108335- (2022)
The spatial distribution of activities and agents within cities, conceptualised as an urban function, profoundly affects how different areas are perceived and lived. This dataset introduces the concept of functional signatures - contiguous areas of a
Externí odkaz:
https://doaj.org/article/0d303b017f5148368143b7b71a8b06e4
Publikováno v:
Communication Quarterly. 38:403-406
Publikováno v:
Communication Quarterly. 38:200-205
Publikováno v:
Condensed Matter Nuclear Science.
Publikováno v:
Polymers, Vol 13, Iss 11, p 1734 (2021)
We report on the cure characterization, based on inline monitoring of the dielectric parameters, of a commercially available epoxy phenol resin molding compound with a high glass transition temperature (>195 °C), which is suitable for the direct pac
Externí odkaz:
https://doaj.org/article/ebce18082f1f4e15a812bf0d34bbd92d