Zobrazeno 1 - 10
of 13
pro vyhledávání: '"Martin Anselm"'
Publikováno v:
Soldering & Surface Mount Technology. 29:99-109
Purpose Solder paste printing is the most common method for attaching surface mount devices to printed circuit boards (PCB), and it has been reported that a majority of all assembly defects occur during the stencil printing process. It is also recogn
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::da920e4f6f4386f29d33cb6fae6ded05
https://doi.org/10.1108/ssmt-05-2016-0010
https://doi.org/10.1108/ssmt-05-2016-0010
Publikováno v:
Journal of Electronic Packaging. 140
In this work, a sinusoidal vibration test method with resonance tracking is employed for reliability testing of circuit assemblies. The system continuously monitors for changes in the resonant frequency of the circuit board and adjusts the excitation
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::14d1a574da108ac78e88ebf169cc4d68
https://doi.org/10.1115/1.4040923
https://doi.org/10.1115/1.4040923
Autor:
Theodore S. Moise, Woody Hu Yiqiang, Karsten Beckmann, Avyaya Jayanthinarasimham, Martin Anselm, Thibault Kempf, Dann Morillon
Publikováno v:
2017 IEEE International Integrated Reliability Workshop (IIRW).
• Precompetitive — University involvement • Fundamental materials research at Universities • Consortia, IMEC, SEMATECH • SRC • Risk averse to taking next step which is taking a precompetitive product into mass production • Closer to mar
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d5c94c006b9e9c5bd2a688e58e911636
https://doi.org/10.1109/iirw.2017.8361247
https://doi.org/10.1109/iirw.2017.8361247
Autor:
Jeff Siddiqui, Scott K. Pozder, Gaddi Haase, Karsten Beckmann, P. Justison, Tom Kopley, Martin Anselm, Matt Ring
Publikováno v:
2017 IEEE International Integrated Reliability Workshop (IIRW).
Are the fields of fracture mechanics, rheology, etc. good enough to address issues In package reliability? No: JEDEC specs all based on DIP wirebond packages. Are we using results from these fields enough or most effectively? Not addressed. Biggest d
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::904e2d75c90333ecfc4c9f8212d1281f
https://doi.org/10.1109/iirw.2017.8361249
https://doi.org/10.1109/iirw.2017.8361249
Autor:
Reza Ghaffarian, Martin Anselm
Publikováno v:
2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
This paper presents thermal-shock cycle (TS) reliability data for various QFN packaging on ENIG PCB surface finish with tin-lead and lead-free solder joints. The TS ranges were within the IPC9701 specification: TC4; −55°C to +125°C and TC5, −55
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::204232e9848ac5d6a787be0164b38057
https://doi.org/10.1109/itherm.2017.7992505
https://doi.org/10.1109/itherm.2017.7992505
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2014:000364-000371
This work investigates the effect of Sn component surface finish on the melting temperature, microstructure, and mechanical behavior of 92.5Pb-5Sn-2.5Ag. 92.5Pb-5Sn-2.5Ag was doped with up to 7% Sn to simulate the final composition of a joint after r
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e71407c182ded2ba215ad668304a5034
https://doi.org/10.4071/hitec-tha26
https://doi.org/10.4071/hitec-tha26
Autor:
X. Dai, Sa'd Hamasha, Venkatesh Arasanipalai Raghavan, Peter Borgesen, Martin Anselm, Michael Meilunas, Mazin Obaidat
Publikováno v:
Microelectronics Reliability. 53:1587-1591
The ultimate life of a microelectronics component is often limited by failure of a solder joint due to crack growth through the laminate under a contact pad (cratering), through the intermetallic bond to the pad, or through the solder itself. Whateve
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b34dcd91c10e5a3e065e06a8daae98a4
https://doi.org/10.1016/j.microrel.2013.07.091
https://doi.org/10.1016/j.microrel.2013.07.091
Autor:
Sa'd Hamasha, Awni Qasaimeh, Martin Anselm, Mazin Obaidat, Younis Jaradat, Babak Arfaei, Peter Borgesen
Publikováno v:
2013 IEEE 63rd Electronic Components and Technology Conference.
Realistic manufacturing, test, handling and service conditions tend to involve significant variations in loading of microelectronics assemblies. However, assessments of reliability are commonly based on accelerated cycling tests with fixed amplitudes
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bc8eeeaabe3e00f1c21bc0803e6c833d
https://doi.org/10.1109/ectc.2013.6575741
https://doi.org/10.1109/ectc.2013.6575741
Autor:
S. Joshi, Peter Borgesen, Babak Arfaei, Richard J. Coyle, Sam Mahin-Shirazi, James R. Wilcox, Eric J. Cotts, Martin Anselm
Publikováno v:
2013 IEEE 63rd Electronic Components and Technology Conference.
Previously crack propagation and joint failure in thermal cycling tests were correlated with recrystallization of Sn grains in SnAgCu (SAC) ball grid array (BGA) solder joints. Generally recrystallization of the Sn grains was observed to occur in the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f8de34f673f9b96fa10b2c4c58ea4df2
https://doi.org/10.1109/ectc.2013.6575693
https://doi.org/10.1109/ectc.2013.6575693
Publikováno v:
Volume 9: Micro- and Nano-Systems Engineering and Packaging, Parts A and B.
We have recently demonstrated a significantly longer life in accelerated thermal cycling for Land Grid Arrays (LGAs) assembled only with SAC305 solder paste than for the corresponding SAC305 based BGA assemblies. This superior performance was shown t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5c3fe0986d19421637d98de2e6cd9197
https://doi.org/10.1115/imece2012-89584
https://doi.org/10.1115/imece2012-89584