Zobrazeno 1 - 10
of 14
pro vyhledávání: '"Marta Kuczynska"'
Publikováno v:
Journal of Composite Materials. 56:3113-3125
It is challenging to predict the material degradation and crack initiation of short fiber reinforced thermoplastics (SFRT) components with high computation efficiency and low parameter identification effort. To achieve that, this work utilizes a hybr
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::614c77fddb3d2e0e82205dff1411b9fe
https://doi.org/10.1177/00219983221109327
https://doi.org/10.1177/00219983221109327
Publikováno v:
2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b49948b5f47a1a07a2dbbd49427f7e98
https://doi.org/10.1109/eurosime54907.2022.9758920
https://doi.org/10.1109/eurosime54907.2022.9758920
Autor:
Siegfried Schmauder, Peter Binkele, Youssef Maniar, A. Kabakchiev, Marta Kuczynska, Masoomeh Bazrafshan
Publikováno v:
ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems.
The increasing electrified mobility poses a challenge on reliability prediction of automotive electronics, especially when safety systems are concerned. The use of finite element simulation for accurate end-of-life prediction of automotive electronic
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1a8c2dc15b13348e8f878db0380c3997
https://doi.org/10.1115/ipack2021-73100
https://doi.org/10.1115/ipack2021-73100
Publikováno v:
ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems.
The reoccurring cyclic load imposed onto soldered electronic components during their operation time leads to accumulation of inelastic strains in the structure. On a microscale level, the degree of plastic deformation is determined by the formation a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::98ca882161a9e546ca08d98602c74487
https://doi.org/10.1115/ipack2021-73319
https://doi.org/10.1115/ipack2021-73319
Autor:
Stefan Weihe, Ulrich Becker, Mike Roellig, Marta Kuczynska, R. Metasch, Natalja Schafet, A. Kabakchiev
Publikováno v:
Microelectronics Reliability. 91:67-85
In the past, a large number of material models for Sn-based solder alloys have been proposed, which are usually calibrated based on the material testing under isothermal conditions. However, their ability to map the lifetime differences depending on
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e3530f8d77dae2646f2eee125ccbabaf
https://doi.org/10.1016/j.microrel.2018.06.007
https://doi.org/10.1016/j.microrel.2018.06.007
Publikováno v:
Composites Science and Technology. 213:108958
Short fiber reinforced thermoplastics (SFRT) are widely used for automotive components. One of the significant challenges in designing industrial SFRT components is an efficient prediction of their mechanical response under mechanical and thermal loa
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::7d07c420663f853f444440be6f6bc44c
https://doi.org/10.1016/j.compscitech.2021.108958
https://doi.org/10.1016/j.compscitech.2021.108958
Autor:
Marta Kuczynska, Ulrich Becker, P. Buhl, B. Metais, Natalja Schafet, A. Kabakchiev, Stefan Weihe
Publikováno v:
Microelectronics Reliability. 74:155-164
This work presents an overview on the role of the stress state and stress Triaxiality Factor (TF, see Eq. (1)) in lifetime prediction of solder connections. According to various literature sources, the TF is one of the most important factors influenc
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3d3c74dd7afeca1d06576e1b796c9855
https://doi.org/10.1016/j.microrel.2017.04.013
https://doi.org/10.1016/j.microrel.2017.04.013
Publikováno v:
2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
In the first part of this paper difference between simulated SN-Curves under shearing and tensile cyclic load are presented and compared with measurement performed by A. Desphante and A. Dasgupta [1–2]. The two load modes are simulated until a spec
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::57ea36db1461b84e50d6110ee8a4abd4
https://doi.org/10.1109/eurosime.2019.8724512
https://doi.org/10.1109/eurosime.2019.8724512
Publikováno v:
Microelectronics Reliability. 120:114101
In the first part of this paper the differences between simulated SN-Curves under shearing and tensile cyclic loads are presented and compared with measurements published by A. Deshpande and A. Dasgupta [1, 2]. The measurements under the two load mod
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bf17c65a57b28325a744c8e160e9cd0f
https://doi.org/10.1016/j.microrel.2021.114101
https://doi.org/10.1016/j.microrel.2021.114101
Publikováno v:
2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
In automotive electronic applications, solder joints are subjected to various loading conditions such as thermomechanical and vibrational loads. Local ther-momechanical passive loads acting on the solder often take place within the time scale of minu
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::71d6cbc6afd9659146014bc3110c3aba
https://doi.org/10.1109/eurosime.2018.8369944
https://doi.org/10.1109/eurosime.2018.8369944