Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Marnie Mattei"'
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2016:000567-000590
New system level IC package integration requires a flexible assembly portfolio. A review of current wafer scale processing and assembly solutions and new development directions is warranted. 2.5D TSV System level IC packaging is not new, but the perf
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f2dcf19eaad8e0d08dae81594693ae7a
https://doi.org/10.4071/2016dpc-tp11
https://doi.org/10.4071/2016dpc-tp11
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2013:000592-000617
Interposers provide a crucial intermediate step for next generation products to allow side-by-side integration of technology optimized. The interposer size in most cases is greater than 22mm on a side and in some designs exceeds 30mm. This large size
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9ab6cb8a910cb5a10f715c2bedf8e148
https://doi.org/10.4071/2013dpc-tp11
https://doi.org/10.4071/2013dpc-tp11
Autor:
Michael G. Kelly, Marnie Mattei
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2012:000347-000376
Interposers provide a crucial intermediate step for next generation products to allow side-by-side integration of technology optimized devices ahead of a full 3D assembly. The interposer size in most cases is greater than 22mm on a side and in some d
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c7ba8bb2767ac4e28811cd72de5312a5
https://doi.org/10.4071/2012dpc-ta12
https://doi.org/10.4071/2012dpc-ta12