Zobrazeno 1 - 4
of 4
pro vyhledávání: '"Markus Frewein"'
Autor:
Julia Vopava, Thomas Kienberger, Andreas Hammer, Bernd Thormann, Lukas Kriechbaum, Christoph Sejkora, Robert Hermann, Karin Watschka, Ulrich Bergmann, Janina Koß, Markus Frewein, Hannes Brandl, Julia Vogel, Simon Moser, Martin Baresch, Kathrin de Bruyn, René Braunstein, Christina Freitag, Markus Peyreder
Publikováno v:
Montanuniversität Leoben
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=dedup_wf_001::0e2452baee1858ba8fe57237c6fe3f7a
https://puretest.unileoben.ac.at/portal/en/publications/move2grid--umsetzung-regionaler-elektromobilitatsversorgung-durch-hybride-kopplung(23e796d5-e11b-4c2d-b30c-03b1ee3afcb4).html
https://puretest.unileoben.ac.at/portal/en/publications/move2grid--umsetzung-regionaler-elektromobilitatsversorgung-durch-hybride-kopplung(23e796d5-e11b-4c2d-b30c-03b1ee3afcb4).html
Autor:
Gerald Pinter, Philipp Novak, Markus Frewein, Peter Filipp Fuchs, Thomas Antretter, Mario Gschwandl
Publikováno v:
Montanuniversität Leoben
Considering the application specific temperature loads microelectronic packages have to endure, thermal management plays a major role for reliability evaluations. A key aspect of thermal management is the assessment of mechanical stresses arising fro
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::ad0df1dd3c8add271a811fcdfe7ee2da
https://puretest.unileoben.ac.at/portal/en/publications/evaluation-of-digital-image-correlation-techniques-for-the-determination-of-coefficients-of-thermal-expansion-for-thin-reinforced-polymers(50d91ac7-dd8b-4a8c-b5c2-b8255e906a9a).html
https://puretest.unileoben.ac.at/portal/en/publications/evaluation-of-digital-image-correlation-techniques-for-the-determination-of-coefficients-of-thermal-expansion-for-thin-reinforced-polymers(50d91ac7-dd8b-4a8c-b5c2-b8255e906a9a).html
Bilingual edition (English/German) / Zweisprachige Ausgabe (deutsch/englisch) Contemporary and future forms of living together urgently need new concepts in order to respond to growing social inequality, the dissolution of traditional structures for
This book describes the latest progress in reliability analysis of microelectronic products. The content grows out of an EU project, named Intelligent Reliability 4.0 - iRel40 (see www.irel40.eu). Different industrial sectors and topics are covered,