Zobrazeno 1 - 7
of 7
pro vyhledávání: '"Markus Bschorr"'
Autor:
Alexander Kaiser, Andreas Munding, Peter Benkart, Markus Bschorr, Arne Heittmann, Holger Huebner, Hans-Joerg Pfleiderer, Ulrich Ramacher, Erhard Kohn
Publikováno v:
ECS Meeting Abstracts. :1763-1763
not Available.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::65d1eb5d3597e6cdf1f826c112a362f3
https://doi.org/10.1149/ma2005-01/45/1763
https://doi.org/10.1149/ma2005-01/45/1763
Autor:
RUI XU1 xurui16a@nudt.edu.cn, SHENG MA2 masheng@nudt.edu.cn, YANG GUO2 guoyang@nudt.edu.cn, DONGSHENG LI2 dsli@nudt.edu.cn
Publikováno v:
ACM Computing Surveys. Jan2024, Vol. 56 Issue 1, p1-37. 37p. 1 Illustration.
Autor:
Benkart, Peter, Kaiser, Alexander, Munding, Andreas, Bschorr, Markus, Pfleiderer, Hans-Joerg, Kohn, Erhard, Heittmann, Arne, Huebner, Holger, Ramacher, Ulrich
Publikováno v:
IEEE Design & Test of Computers; Nov/Dec2005, Vol. 22 Issue 6, p512-518, 7p, 5 Black and White Photographs, 4 Diagrams, 2 Graphs
The first encompassing treatise of this new, but very important field puts the known physical limitations for classic 2D electronics into perspective with the requirements for further electronics developments and market necessities. This two-volume h
Autor:
Mou, Dengpan
Machine-based Intelligent Face Recognition discusses the general engineering method of imitating intelligent human brains for video-based face recognition in a fundamental way, which is completely unsupervised, automatic, self-learning, self-updated
Autor:
Munding, Andreas
3D-integration, or vertical chip integration, is a technology that aims to shorten the interconnect path between integrated circuits and to increase the interconnect density by using through-chip micro vias. It allows a smaller ciruit footprint by ch
Autor:
Kaiser, Alexander
Die Entwicklung der integrierten Schaltungen („ICs“), seien es nun Mikroprozessoren oder anwendungsspezifische Schaltungen, hat mit steigender Funktionsdichte auch erhöhte Verdrahtungslängen zur Folge. Um die erhöhten Anforderungen diesbezügl