Zobrazeno 1 - 2
of 2
pro vyhledávání: '"Markku Sillanpää"'
Autor:
Manu Mäkelä, Toni T. Mattila, Heikki Ruotoistenmäki, Jussi Hokka, Ville Halkola, Markku Sillanpää, Esa Hussa, Jani Raami
Publikováno v:
Microelectronics Reliability. 54:785-795
A consortium composed of industrial and academic representatives has been working on an update for the widely-employed JESD22-B111 drop test standard for handheld electronics. To form a better understanding of the drop response of handheld devices, t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::50420762dac159c150a5b2d698711a54
https://doi.org/10.1016/j.microrel.2013.11.017
https://doi.org/10.1016/j.microrel.2013.11.017
Autor:
Markku Sillanpää, Henrik Saxén
Publikováno v:
Modelling and Simulation in Materials Science and Engineering. 2:79-98
Many of the difficulties that may be encountered during the continuous casting of steel are caused by an inappropriate liquid steel temperature in the steelmaking tundish. This paper presents a temperature prediction model which is used in a prototyp
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cb652a9b8869e6460aaebbd918695412
https://doi.org/10.1088/0965-0393/2/1/006
https://doi.org/10.1088/0965-0393/2/1/006