Zobrazeno 1 - 8
of 8
pro vyhledávání: '"Mark W. Sugden"'
Autor:
Mark W. Sugden, Hiren Kotadia, Arunkumar Panneerselvam, Hector Steen, Samjid H. Mannan, Mark Green
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 3:1786-1793
In this paper, we report a comparison of interfacial reactions of Sn-3.8Ag-0.7Cu (SAC 387) and SAC (0-1.5 Zn) solder pastes on Cu (organic solderability preservative finish) and Au/Ni-P/Cu [electroless Ni immersion gold (ENIG)] substrate metallizatio
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::46be15c897c3740570f69635e6d4bb6a
https://doi.org/10.1109/tcpmt.2013.2279055
https://doi.org/10.1109/tcpmt.2013.2279055
Publikováno v:
2016 6th Electronic System-Integration Technology Conference (ESTC).
Metalized micron scale polymer particles have been utilised in anisotropically conductive adhesives for a number of years and more recent work has investigated their selective deposition to provide interconnects. In this work such particles have succ
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c2f577e235d5b7d4736e802ccd46f056
https://doi.org/10.1109/estc.2016.7764690
https://doi.org/10.1109/estc.2016.7764690
Publikováno v:
Circuit World. 38:214-218
PurposeThe purpose of this paper is to present an outline of the development of a new process for the formation of flip‐chip interconnections using metal coated polymer microparticles.Design/methodology/approachMetal coated polymer microparticles w
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a58ab0dcfeb1f1ab6b85ab8d89dd8d7b
https://doi.org/10.1108/03056121211280422
https://doi.org/10.1108/03056121211280422
Autor:
Hadi AlQahtani, Mark W. Sugden, Nic Mullin, Martin Grell, Delia Puzzovio, Tim Richardson, Lee Hague
Publikováno v:
Sensors and Actuators B: Chemical. 160:399-404
We deposit dense, ordered, thin films of Au–dodecanethiol core/shell nanoparticles by the Langmuir–Schafer (LS) printing method, and find that their resistance at ambient temperature responds selectively and sensitively to alkane odours. Response
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b56906eb8940c939f1a8715e9f9a5d27
https://doi.org/10.1016/j.snb.2011.07.068
https://doi.org/10.1016/j.snb.2011.07.068
Publikováno v:
Langmuir. 26:4331-4338
The optical and electrical properties of dodecanethiol-stabilized nanoparticles (6 nm diameter gold core) have been investigated over a range of film thicknesses and temperatures. The surface plasmon resonance absorbance is found to be dependent on t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::d9ada1db66226dfd45b50a4c2e265b75
https://doi.org/10.1021/la903410b
https://doi.org/10.1021/la903410b
Autor:
Timothy J. Mason, David A. Hutt, Andrew J. Cobley, Mark W. Sugden, John E. Graves, Robert E. Litchfield
Publikováno v:
Ultrasonics sonochemistry. 29
This paper describes the ultrasound assisted dispersal of a low wt./vol.% copper nanopowder mixture and determines the optimum conditions for de-agglomeration. A commercially available powder was added to propan-2-ol and dispersed using a magnetic st
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::13d853e8f3c4aac83270cc90c00aeccb
https://pubmed.ncbi.nlm.nih.gov/26585024
https://pubmed.ncbi.nlm.nih.gov/26585024
Publikováno v:
2014 IEEE 16th Electronics Packaging Technology Conference (EPTC).
Electroless copper plating of insulating substrates, such as printed circuit boards, typically requires the pre-deposition of a catalyst layer onto the surface to initiate the chemical reactions. Pd/Sn based catalysts are widely used, but carry a hig
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2efc170ec59a6c1a894847ad6ff74090
https://doi.org/10.1109/eptc.2014.7028381
https://doi.org/10.1109/eptc.2014.7028381
Publikováno v:
2012 IEEE 62nd Electronic Components and Technology Conference.
The increasing demand for fine pitch flip-chip interconnection has led to significant interest in alternatives to the widely used solder joints. The use of mono-sized metal coated polymer based micro-spheres is emerging as a method to achieve more ro
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5ef8e98793f2434e5049212ae4f77261
https://doi.org/10.1109/ectc.2012.6248831
https://doi.org/10.1109/ectc.2012.6248831