Zobrazeno 1 - 10
of 25
pro vyhledávání: '"Mark T. North"'
Publikováno v:
Technologies for Optical Countermeasures XIV.
Next-generation infrared countermeasure (IRCM) systems call for compact and lightweight high-power laser sources. Specifically, optical output power of tens of Watts in the mid-wave infrared (MWIR) is desired. Monolithically fabricated arrays of quan
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 3:2048-2058
This paper assesses the use of variable conductance heat pipes (VCHPs) for reduced-power precision temperature control of photonics components. When subambient cooling is not required we consider only a VCHP and where it is required we consider a VCH
Publikováno v:
The International Journal of Advanced Manufacturing Technology. 31:905-914
This paper investigates the performance of a cutting tool embedded with a heat pipe on reducing cutting temperature and wear in machining. The temperature of a tool plays an important role in thermal distortion and the machined part’s dimensional a
Autor:
Mark T. North, Dennis L. Youchison
Publikováno v:
Fusion Technology. 39:899-904
Helium-cooled, refractory heat exchangers are now under consideration for first wall and divertor applications. These refractory devices take advantage of high temperature operation with large delt...
Publikováno v:
Fusion Engineering and Design. :407-415
Pressurized helium is under consideration for cooling Langmuir probes and plasma facing components of next generation fusion experiments. Helium is non-corrosive, does not activate, separated easily from tritium, vacuum compatible, and undergoes no p
Autor:
James E. Lindemuth, Dennis L. Youchison, John H. Rosenfeld, Richard Goulding, Robert D. Watson, Mark T. North
Publikováno v:
Fusion Technology. 29:449-458
Several types of porous media heat exchangers are being evaluated for use infusion applications. Broadly, these devices can be classified as capillary-pumped (heat pipes) or mechanically-pumped hea...
Publikováno v:
ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2.
Spreading of high-flux electronics heat is a critical part of any packaging design. This need is particularly profound in advanced devices where the dissipated heat fluxes have been driven well over 100W/cm2 . To address this challenge, researchers a
Publikováno v:
Scopus-Elsevier
Thermosyphons are passive devices used to transfer heat via a liquid-vapor phase change cycle. By adding a secondary non-condensable gas (NCG) to the vapor phase of the thermosyphon it is possible to provide some control over the evaporator temperatu
Publikováno v:
ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference, Volume 3.
Thermoelectric modules (TEMs) consume a large amount of power when used for precision temperature control of high-power photonic devices, particularly when subjected to a wide range of ambient temperatures. The use of variable conductance heat pipes
Publikováno v:
Heat Transfer, Volume 2.
Thermoelectric modules (TEMs) are widely used to provide precision temperature control in photonic applications. A problem with TEMs, however, is that when they are subjected to a large range of ambient temperatures the power of consumption of TEMs c