Zobrazeno 1 - 10
of 24
pro vyhledávání: '"Mark Schadt"'
Autor:
Jian-Q. Wang, Nam Kim, Susan Lu, Weibing Hao, Chen Zhang, Xiajing Shi, Chuan-Jian Zhong, Jin Luo, Derrick Mott, Mark Schadt, Nancy N. Kariuki, Lingyan Wang
Publikováno v:
Sensors, Vol 6, Iss 6, Pp 667-679 (2006)
This paper describes the results of a study of a few design parameters influencingthe performance of sensor arrays constructed from nanostructured thin films andinterdigitated microelectrodes (IMEs). The nanostructured thin films on the IME deviceswe
Externí odkaz:
https://doaj.org/article/a0c9c51d7c344994858d4487cd76e17f
Autor:
Kanad Ghose, Mark D. Poliks, Yasser Khan, Konstantinos I. Papathomas, Mark Schadt, Natasha A. D. Yamamoto, Donggeon Han, Madina Zabran, Varun Soman, Paul Joseph Hart, Frank D. Egitto, Michael Shay, Ana Claudia Arias, James N. Turner
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 9:1872-1887
Flexible hybrid electronics (FHE) interface rigid electronic components with flexible sensors, circuits, and substrates. This paper reports the reliability improvement of an FHE human performance monitor (HPM), designed to monitor electrocardiography
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3fce32065198c73fc4f62d70d92519dc
https://doi.org/10.1109/tcpmt.2019.2919866
https://doi.org/10.1109/tcpmt.2019.2919866
Publikováno v:
International Symposium on Microelectronics. 2017:000194-000200
Flexible Hybrid Electronic (FHE) devices interface flexible sensors and circuits with conventional rigid electronic components. This work reports preliminary results for the reliability aspects of a project aimed at fabricating a Wearable Sensor Patc
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fbc98a9c62b0de44d054cce6b7ab2abb
https://doi.org/10.4071/isom-2017-wa23_137
https://doi.org/10.4071/isom-2017-wa23_137
Autor:
Abhinav M. Gaikwad, Zhanpeng Jin, William Wilson, Mark Schadt, Frank D. Egitto, Mohit Garg, Robert Welte, Ana Claudia Arias, Steve Czarnecki, Mark D. Poliks, Kanad Ghose, Natasha A. D. Yamamoto, Yasser Khan, Donggeon Han, Paul Joseph Hart, Qiong Gui, James N. Turner
Publikováno v:
Advanced Functional Materials. 26:8764-8775
The interfacing of soft and hard electronics is a key challenge for flexible hybrid electronics. Currently, a multisubstrate approach is employed, where soft and hard devices are fabricated or assembled on separate substrates, and bonded or interface
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f1ae8d0fee530d9d7a03dd4f3de0d707
https://doi.org/10.1002/adfm.201603763
https://doi.org/10.1002/adfm.201603763
Publikováno v:
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
Flexible hybrid electronic devices, which interface flexible sensors, circuits and substrates with rigid electronic components present a unique reliability challenge due to their high conformity which induce high stresses and strains. This paper focu
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::75f1f9e7785125935298964fd3e119b8
https://doi.org/10.1109/ectc.2018.00280
https://doi.org/10.1109/ectc.2018.00280
Publikováno v:
The Analyst. 140:8023-8032
In the organic-aqueous phase transfer process of gold nanoparticles, there are two types of distinctive interfaces involving hydrophilic and hydrophobic ligands, the understanding of which is important for the design of functional nanomaterials for a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::dda4e2daac2c037ee5e8f482c9d49889
https://doi.org/10.1039/c5an01915j
https://doi.org/10.1039/c5an01915j
Autor:
Zhanpeng Jin, Mark Schadt, Kanad Ghose, Ana Claudia Arias, Frank D. Egitto, James N. Turner, Mark D. Poliks, Mohit Garg, Yasser Kahn, Qiong Gui
Publikováno v:
2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
Flexible hybrid electronics (FHE) integrate both traditional printed circuits, solder assembled standard and thinned silicon chips along with printable electronic materials and sensors. The combination results in high performance from thin, light wei
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7a6050447a87dbaec1210ae5523340e7
https://doi.org/10.1109/ectc.2016.395
https://doi.org/10.1109/ectc.2016.395
Autor:
V. Markovich, Steven G. Rosser, William Wilson, Mark Schadt, Rabindra N. Das, Frank Egitto, Timothy Antesberger
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2011:001876-001897
Greater I/O density at the die level, more demanding performance requirements, and the continued desire to package more function into smaller devices is driving the need for improved wiring density and a concomitant reduction in feature sizes for ele
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a5d88f01326a4ea7f7e1b616ef7cdc6f
https://doi.org/10.4071/2011dpc-wp35
https://doi.org/10.4071/2011dpc-wp35
Publikováno v:
Langmuir. 26:618-632
The use of metal nanoparticles as building blocks toward thin film assembly creates intriguing opportunities for exploring multifunctional properties. Such an exploration requires the ability to engineer the size, shape, composition, and especially i
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::1a3543efcd572f6848cd1d6dea8decd0
https://doi.org/10.1021/la901811g
https://doi.org/10.1021/la901811g
Autor:
Chuan-Jian Zhong, Jin Luo, I-Im S. Lim, Peter N. Njoki, Hye-Young Park, Mark Schadt, Derrick Mott, Benjamin L. Cotts
Publikováno v:
Journal of Scanning Probe Microscopy. 3:1-8
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e4f057ffd05d844b7f069ea580772312
https://doi.org/10.1166/jspm.2008.001
https://doi.org/10.1166/jspm.2008.001