Zobrazeno 1 - 5
of 5
pro vyhledávání: '"Mark Luke Farrugia"'
Publikováno v:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bc11e3851b5f8e2d5918ea2af68396f2
https://doi.org/10.1109/ectc51906.2022.00326
https://doi.org/10.1109/ectc51906.2022.00326
Autor:
Mark Luke Farrugia
Publikováno v:
2016 IEEE 18th Electronics Packaging Technology Conference (EPTC).
Since the introduction of Cu wire-bonding in the semiconductor industry, corrosion of the Cu-Al intermetallics (IMCs) has been one of the main concerns in developing reliable products using this interconnect technology. Much insight has been gained i
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e73c901f6108977956dc785635019c7b
https://doi.org/10.1109/eptc.2016.7861456
https://doi.org/10.1109/eptc.2016.7861456
Publikováno v:
2014 IEEE 64th Electronic Components and Technology Conference (ECTC).
Large scale conversion of gold to copper wiring in microelectronics can only become successful when all the failure mechanisms that can be encountered during reliability testing, or during product application life are understood. One of these mechani
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fbae6b08ac691b5126805e56f8c150c0
https://doi.org/10.1109/ectc.2014.6897318
https://doi.org/10.1109/ectc.2014.6897318
Autor:
Mark Luke Farrugia
Publikováno v:
2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013).
Copper wire bonding as a replacement to the long established gold wire process has gained significant momentum in the last years. Wire bonding specialists have struggled with copper's mechanical, physical and chemical differences to gold, in developi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b1e9e78549ab68546fccc8fec0801317
https://doi.org/10.1109/eptc.2013.6745706
https://doi.org/10.1109/eptc.2013.6745706
Autor:
Benjamin März, Michael Rother, Tina Li, Kan Lee, Hans-Juergen Funke, Robert Klengel, Mandy Ullrich, Mark Luke Farrugia, Karina Leung, Tim Boettcher, Martin Li, Orla O'Halloran, Andreas Pinkernelle, Matthias Petzold, Michael Kaiser, Stefan Liedtke, Marc Bollmann, Daniel Gruber
Publikováno v:
2010 12th Electronics Packaging Technology Conference.
A detailed description of the Cu-Al wire bond interface is presented, which can possibly explain the often observed corrosion failures in humidity reliability tests. Using micro-structural analysis techniques, it is shown that the unstressed interfac
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f1e10ff42133020288220649e990d270
https://doi.org/10.1109/eptc.2010.5702706
https://doi.org/10.1109/eptc.2010.5702706