Zobrazeno 1 - 2
of 2
pro vyhledávání: '"Mark Krmpotich"'
Autor:
Richard Coyle, Wilson Zhen, Brook Sandy-Smith, Kok Kwan Tang, Mark Krmpotich, Kevin Byrd, Qin Chen, Greg Wu, Shunfeng Cheng, Haley Fu, Jimmy Chen, Scott Mokler, Anny Zhang, Raiyo Aspandiar, Jagadeesh Radhakrishnan, Morgana Ribas, Sophia Feng
Publikováno v:
2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC).
Lowering peak reflow temperature from the current 240°C+ level for SnAgCu (SAC) solder paste during the assembly of electronic board products has economic, environmental and technical benefits. The Bi-Sn solder system is one low melting metallurgica
Autor:
Jimmy Chen, Anny Zhang, Mark Krmpotich, Morgana Ribas, Richard Coyle, Sophia Feng, Wilson Zhen, Qin Chen, Kok Kwan Tang, Jagadeesh Radhakrishnan, Haley Fu, Raiyo Aspandiar, Brook Sandy-Smith, Greg Wu, Shunfeng Cheng, Bill Hardin, Scott Mokler
Publikováno v:
2018 Pan Pacific Microelectronics Symposium (Pan Pacific).
In 2015, the International Electronics Manufacturing Initiative (iNEMI) initiated the Bismuth-Tin (Bi-Sn) based Low-Temperature Soldering Process and Reliability (LTSPR) Project. The goal of this project was to address the challenge of evaluating new