Zobrazeno 1 - 1
of 1
pro vyhledávání: '"Mark Harrison Mcleod"'
Autor:
Peter J. Brofman, Derek Daily, Yasumitsu Orii, Takashi Nauchi, Kazuya Ishiguro, Paul A. Lauro, Tomoyasu Yoshikawa, Jeffrey D. Gelorme, Ryoichi Suzuki, Mark Harrison Mcleod, Peter J. Sorce, Eric D. Perfecto, Kazushige Toriyama, Akira Takaguchi, Jae-Woong Nah
Publikováno v:
2014 IEEE 64th Electronic Components and Technology Conference (ECTC).
In this paper, we will describe a new low cost solder bumping technology for use on wafers. The wafer IMS (injection molded solder) process can form fine pitch solder bumps on wafers, while offering greater solder alloy flexibility. This method is al
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::676c03e3f33638e3d705118b8d50795c
https://doi.org/10.1109/ectc.2014.6897461
https://doi.org/10.1109/ectc.2014.6897461
