Zobrazeno 1 - 10
of 18
pro vyhledávání: '"Mark D. Jaffe"'
Autor:
John Ellis Monaghan, Satyasuresh Choppalli, Venkata Narayana Rao Vanukuru, Alvin J. Joseph, Balaji Swaminathan, Anupam Dutta, Mark D. Jaffe, Yue Tan, Randy Wolf, Ron Logan
Publikováno v:
2020 IEEE 20th Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems (SiRF).
In this paper, significant improvement in cascode LNA performance is demonstrated by using a new high self gain (HSG) common gate (CG) transistor. Emphasis has been on making the output conductance $g_{ds}$ lower and flatter with drain bias. A protot
Publikováno v:
Circuits at the Nanoscale ISBN: 9781315218762
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::16a45c67cf13bac3881c470b47832f7f
https://doi.org/10.1201/9781315218762-24
https://doi.org/10.1201/9781315218762-24
Autor:
Venkata Narayana Rao Vanukuru, Steven M. Shank, Anthony K. Stamper, Balaji Swaminathan, Aaron L. Vallett, Alvin J. Joseph, Rick Phelps, John J. Ellis-Monaghan, Adusumilli Siva P, Mark D. Jaffe, Ananth Sundaram, Michel J. Abou-Khalil, Randy L. Wolf
Publikováno v:
2018 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S).
Integration of high performance switch with Low Noise Amplifier (LNA) devices results in state of the art performance for 5G Front End Module applications. Here we review switch+ LNA performance metrics and its evolution over the last 10 years and hi
Autor:
John J. Ellis-Monaghan, James A. Slinkman, Michel J. Abou-Khalil, Steven M. Shank, Richard A. Phelps, Zhong-Xiang He, Jeff Gross, Jeffrey P. Gambino, Mark D. Jaffe, Randy L. Wolf, Alan B. Botula, Alvin J. Joseph
Publikováno v:
2015 IEEE 15th Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems.
Over the past few years, CMOS Silicon-oninsulator (SOI) has emerged as the dominant technology for RF switches in RF front end modules for cell phones and WiFi. RF SOI technologies were created from silicon processes originally used for high speed lo
Autor:
Randy L. Wolf, Robert M. Rassel, Shyam Parthasarathy, Mccallum-Cook Ian, Hanyi Ding, K. Newton, Renata Camillo-Castillo, Anthony K. Stamper, Mark D. Jaffe, Alvin J. Joseph, James S. Dunn, Michael J. Zierak, Srikanth Srihari, Vibhor Jain, Nicholas Theodore Schmidt
Publikováno v:
2014 IEEE Bipolar/BiCMOS Circuits and Technology Meeting (BCTM).
Autor:
Kimball M. Watson, J. Malinowski, T. Aoki, J. Gambino, Mark D. Levy, K.K. Sims, P.F. Chapman, R.S. Graf, A. Cote, G.A. Mason, W. Guthrie, Mark D. Jaffe
Publikováno v:
IEEE International Interconnect Technology Conference.
RF devices are sensitive to noise coupling between devices. One source of coupling is the edge seal ring. We propose using a segmented guard ring to reduce coupling between devices. We demonstrate that the segmented guard ring is reliable for a 0.18
Autor:
Eric A. Johnson, Derrick Liu, Mark D. Jaffe, Anthony K. Stamper, Shyam Parthasarthy, Michael J. Zierak, James S. Dunn, Alvin J. Joseph, Renata Camillo-Castillo, Hanyi Ding, Robert M. Rassel, Venkata Vanakuru, Jeff Gambino, Santosh Sharma
Publikováno v:
2013 IEEE Bipolar/BiCMOS Circuits and Technology Meeting (BCTM).
We present for the first time a novel high resistivity bulk SiGe BiCMOS technology that has been optimized for a WiFi RF front-end-IC (FEIC) integration. A nominally 1000 Ohm-cm p-type silicon substrate is utilized to integrate several SiGe HBTs for
Autor:
Mark D. Jaffe, Alan B. Botula, Randy L. Wolf, Steven Moss, James A. Slinkman, Michel J. Abou-Khalil, John J. Ellis-Monaghan, Alvin J. Joseph, Rick Phelps
Publikováno v:
2013 IEEE Radio Frequency Integrated Circuits Symposium (RFIC).
In this study, we define and investigate the maximum power handling capability (Pmax) in an SOI RF shunt branch switch. One of the critical factor in the Pmax is the non-uniform voltage division across an OFF shunt branch. In this study we provide a
Autor:
Alvin J. Joseph, Theodore J. Letavic, James A. Slinkman, Michel J. Abou-Khalil, Mark D. Jaffe, Alan B. Botula
Publikováno v:
2013 25th International Symposium on Power Semiconductor Devices & IC's (ISPSD).
We present a new device design for 20V application in thin body SOI technology. High breakdown voltage is achieved by forming RX-bound field plates which deplete the drift region of an LDMOS structure using only lateral electric field coupling. A bas
Autor:
Wendell P. Noble, B. F. Lloyd, Steven J. Holmes, Stephen Frank Geissler, Jerome B. Lasky, Eric Adler, Michael D. Armacost, James S. Nakos, Glen L. Miles, Steven H. Voldman, Mark D. Jaffe, Jeffrey B. Johnson, Richard A. Ferguson, John K. DeBrosse, C. W. Koburger
Publikováno v:
IBM Journal of Research and Development. 39:167-188